The stress effect on electrical resistivity sensitivity of FeBSiC amorphous ribbon

Maricic, A.; Spasojević, M.; Kalezić-Glišović, Aleksandra; Ribić-Zelenović, Lenka; Djukic, Aleksandar; Mitrović, Nebojša

doi:10.1016/j.sna.2011.12.022

Cited by 11 publications

(7 citation statements)

References 12 publications

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“…Dependence of TEMF -e upon temperature AT (AT = T-Tr, Tr = 273 K), is given by the equation £=a-AT where a is thermopower (Seebeck coefficient) defined as: k ( n, n2 | 2«l«2 >h ) (5) where: k-Boltzmann constant, e-electron charge, n,-ffee electron state density at Fermi level in copper, n2-free electron density at Fermi level in the metastable AlSilOMg alloy [21]. The diagram in Fig.…”

Section: Analysis O F Temf Measurement Results Induced By Thermal Trementioning

confidence: 99%

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Effect of heat treatment on structural changes in metastable AlSi10mg alloy

Jordović

Nedeljkovic

Mitrović

et al. 2014

J min metall B Metall

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This paper presents a study on structural changes occurring in a rapidly quenched metastable AlSilO M g alloy during heating cycles within the temperature range from room temperature to 800 K. M easurement o f electrical resistivity o f a ribbon show ed that structural stabilization takes place at temperatures ranging from 450 K to 650 K. The isotherms o f the electrical resistivity measured at temperatures 473 K, 483 K and 498 K revealed two stages o f structural stabilization i.e. a kinetic process and diffusion process. Measurement o f the thermoelectromotive force o f the thermocouple made from the investigated alloy and a copper conductor by a mechanical jo in in g was used to determine relative changes in the electron density o f states o f the quenched sample after successive heat treatments.The sam e alloy sample was subjected to successive heat treatments a t temperatures up to 503 K, 643 K, 683 K and 763 K. The change in the thermopower suggested that each heating was fo llo w ed by an increase in free electron density in the alloy. Therefore, the abrupt decline in electrical resistivity was induced by an increase in both the mean free electron path and fre e electron density during the thermal stabilization o f the structure.

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Section: Analysis O F Temf Measurement Results Induced By Thermal Trementioning

confidence: 99%

“…A reliable contact between the leads and the ribbon has to be ensured during thermoelectric measurements. The TEMF of the alloy was measured by the compensation method having a sensitivity of 10'5 V [21]. Thermoelectrical processing was performed in a protecting argon atmosphere.…”

Section: Methodsmentioning

confidence: 99%

Effect of heat treatment on structural changes in metastable AlSi10mg alloy

Jordović

Nedeljkovic

Mitrović

et al. 2014

J min metall B Metall

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“…When subjected to mechanical stress, metals undergo deformation simultaneously with a change in their microstructure. The degree of short-range order decreases, while the density of chaotically distributed dislocations and internal microstress increase [1][2][3]. Some atoms make a transition to higher energy levels that exhibit a larger equilibrium distance between adjacent atoms and a smaller overlap of their valence orbitals, thus causing a decrease in the free electron density of states near the Fermi level [4][5].…”

Section: Introductionmentioning

confidence: 99%

Effect of the degree of plastic deformation on the thermal electromotive force of cu-x5crni1810 steel thermocouple

et al. 2018

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The thermal electromotive force (TEMF) and the thermal electromotive force coefficient (TEMFC) of the thermocouple consisting of a copper wire and an (X5CrNi1810) steel wire plastically deformed under tension or bending conditions were found to increase with increasing degree of plastic deformation. The increase in the degree of deformation disturbs the microstructure of steel due to increases in the density of chaotically distributed dislocations and internal microstress, resulting in a decrease in the electron density of states near the Fermi level. Through the effect of thermal energy, annealing at elevated temperatures up to 300 o C leads to microstructural ordering along with simultaneous increases in the free electron density of states, TEMF and TEMFC. Based on the temporal change of the TEMF, the kinetics of microstructural ordering was determined. During the initial time interval, the process is a kinetically controlled first-order reaction. In the second time interval, the process is controlled by the diffusion of reactant species.

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“…Activation energy is required for the processes occurring in the crystal lattice of the metal at an atomic level, such as the creation and motion of vacancies, diffusion, a positive and negative climb of dislocations, transverse sliding of dislocations, etc. [1,2]. As all these processes can be thermally activated, the deformed material should be heated in order that it can restore the properties that existed before deformation [3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Experimental identification of the degree of deformation of a wire subjected to bending

et al. 2018

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This study provides experimental verification of analytical results on maximum strain ε max in elements fabricated by bending a stainless steel wire around a cylinder with given dimensions. The method of measuring the thermal electromotive force (TEMF) of a thermocouple formed by joining the deformed metal specimen to a copper (Cu) conductor showed an increase in the thermal electromotive force coefficient (TEMFC) during heating with increasing degree of plastic deformation. For known values of plastic deformation produced by straining X5CrNi1810 stainless steel wire specimens of ∅2.8 mm diameter, the TEMF was determined as a function of the extent of deformation of the thermocouple consisting of the deformed steel wire specimen and the copper conductor. Based on the correlation (calibration curve), it was shown that the relative strain of the element fabricated by bending the same wire (made of X5CrNi1810 stainless steel, ∅2.8 mm in diameter) around the cylinder of ∅10 mm diameter is 23.8 %.

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The stress effect on electrical resistivity sensitivity of FeBSiC amorphous ribbon

Cited by 11 publications

References 12 publications

Effect of heat treatment on structural changes in metastable AlSi10mg alloy

Effect of heat treatment on structural changes in metastable AlSi10mg alloy

Effect of the degree of plastic deformation on the thermal electromotive force of cu-x5crni1810 steel thermocouple

Experimental identification of the degree of deformation of a wire subjected to bending

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