2012
DOI: 10.1002/jnm.1858
|View full text |Cite
|
Sign up to set email alerts
|

The study of packaging miniaturization effect on the characteristics of an active planar circuit by using the iterative method

Abstract: The aim of this manuscript is to present the application of an iterative method based on the concept of transverse wave to analyze the packaging (passive element and substrate) miniaturization effect on the characteristics of an active planar circuit structure. This approach consists in the substitution of the active element by one auxiliary source, and connection is assumed by microstrip line as passive element deposited on one unique substrate. An implementation of the presented theory is shown by extraction… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2019
2019
2019
2019

Publication Types

Select...
1

Relationship

1
0

Authors

Journals

citations
Cited by 1 publication
(1 citation statement)
references
References 20 publications
0
1
0
Order By: Relevance
“…The bottom surface of the substrate is PEC (perfect electric conductor) witch present a ground plane and the top surface is air. [13][14][15][16] 192…”
Section: Methodsmentioning
confidence: 99%
“…The bottom surface of the substrate is PEC (perfect electric conductor) witch present a ground plane and the top surface is air. [13][14][15][16] 192…”
Section: Methodsmentioning
confidence: 99%