The tacking CCD: a new CCD concept

Abstract

Abstract-The Tacking CCD is a new type of charge transport mechanism that is suitable for junction-as well as MOStype CCD's. A specific form, the Trenched Tacking CCD (TTCCD), promises high pixel density and high charge handling capability per unit of surface area. The TTCCD structure is suitable for making new types of solid-state image sensors with increased light sensitivity and there is the possibility of incorporating a vertical overflow drain. First samples of the TTCCD have been realized and its functionality has been confirmed.

Fully Depleted, Trench-Pinned Photo Gate for CMOS Image Sensor Applications

“…We propose in this paper a novel concept for pixel implementation, introducing a vertical pinned photogate (PPG) to replace deep PPD using epitaxial silicon as the active layer. In continuation of the former planar charge-coupled device (CCD) and implanted trench photo MOS concept [6][7][8][9], the proposed integration requires no implantation [10], thus avoiding issues of defect creation and contamination. Secondly, to efficiently drain charges stored in the PPG, the development of a buried vertical TG in pipe form between the charge storage region and surface sensing node (SN, also called floating diffusion or FD) is proposed.…”