The technology of finely focused ion beams

Harriott, L. R.

doi:10.1016/0168-583x(91)96284-r

Cited by 23 publications

(6 citation statements)

References 47 publications

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“…This is done so that the mean free paths of the ions are increased and the strength of the beam is not reduced due to the interference of the particles in the chamber (Melngailis 1987(Melngailis , 2001. This system usually produces ion energies from 50 to 250 keV with the minimum full width at half-maximum (FWHM) beam diameter down to 50 nm and it can be used for both sputtering and implantation (Harriott 1991, Bi et al 1998. Many alloys can be used in this type of system to produce different types of ion sources (Takai et al 1996).…”

Section: Fib Systemsmentioning

confidence: 99%

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Recent developments in micromilling using focused ion beam technology

Tseng

2004

J. Micromech. Microeng.

365

223

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The application of focused ion beam (FIB) technology in microfabrication has become increasingly popular. Its use in microfabrication has advantages over contemporary photolithography or other micromachining technologies, such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. An overview of the recent development in FIB microfabrication technology is given. The emphasis will be on direct milling, or maskless techniques, and this can distinguish the FIB technology from the contemporary photolithography process and provide a vital alternative to it. After an introduction to the technology and its FIB principles, the recent developments in using milling techniques for making various high-quality devices and high-precision components at the micrometer scale are examined and discussed. Finally, conclusions are presented to summarize the reviewed work and to suggest the areas for improving the FIB milling technology and for future research.

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Section: Fib Systemsmentioning

confidence: 99%

“…FIB systems with a single-lens column have also been used for providing relatively low-energy ions at the range of 10-50 keV (Harriott 1991, Yu et al 1994. In a singlelens system, the ions are extracted from the LMIS and passed through a beam-limiting aperture to an electrostatic lens.…”

Section: Fib Systemsmentioning

confidence: 99%

Recent developments in micromilling using focused ion beam technology

Tseng

2004

J. Micromech. Microeng.

365

223

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“…Progress in both ion optics and computer software has allowed tight control of both the dimensions of the focal spot of ions and the rastering of that spot, such that nanoscale features can now routinely be milled into specimens using this focused ion beam (FIB) technique. Commercially manufactured FIB systems have therefore been able to emerge from the laboratory into limited production applications [1].…”

Section: Introductionmentioning

confidence: 99%

Strategies for gallium removal after focused ion beam patterning of ferroelectric oxide nanostructures

Schilling

Adams²,

Bowman³

et al. 2007

Nanotechnology

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As part of a study into the properties of ferroelectric single crystals at nanoscale dimensions, the effects that focused ion beam (FIB) processing can have, in terms of structural damage and ion implantation, on perovskite oxide materials has been examined, and a post-processing procedure developed to remove such effects. Single crystal material of the perovskite ferroelectric barium titanate (BaTiO(3)) has been patterned into thin film lamellae structures using a FIB microscope. Previous work had shown that FIB patterning induced gallium impregnation and associated creation of amorphous layers in a surface region of the single crystal material some 20 nm thick, but that both recrystallization and expulsion of gallium could be achieved through thermal annealing in air. Here we confirm this observation, but find that thermally induced gallium expulsion is associated with the formation of gallium-rich platelets on the surface of the annealed material. These platelets are thought to be gallium oxide. Etching using nitric and hydrochloric acids had no effect on the gallium-rich platelets. Effective platelet removal involved thermal annealing at 700 degrees C for 1 h in a vacuum followed by 1 h in oxygen, and then a post-annealing low-power plasma clean in an Ar/O atmosphere. Similar processing is likely to be necessary for the full recovery of post FIB-milled nanostructures in oxide ceramic systems in general.

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“…Because of the sputtering capability, focused ion beam (FIB) technique has emerged as a good tool for the fabrication of diverse metallic micro-and nano-structures [12][13][14][15][16][17]. Based on these reports about the capability of FIB process, we believe that the microstructures shown in Fig.…”

Section: Methodsmentioning

confidence: 99%