The Top‐CARL, process: A patterning technique for organic materials

Abstract

The patterning of organic layer materials is often hindered by the effects of the conditions used to “develop” the resist material, for example high temperatures for strong bases, which attack the substrate. The process described here allows the patterning even of delicate layers of oriented nonlinear optical polymers. The figure shown a patterned polyimide film 115 μm thick.

Microfabrication of PPy microactuators and other conjugated polymer devices

“…This is another method that we use in the fabrication of our bilayers. A general method for patterning organic materials is the Top-CARL technique, in which photoresist is silylated to make it resistant to RIE [147].…”

“…Thus, the maximum final PPy thickness is less than or equal to the thickness of the resist. (The Top-CARL process would circumvent this problem [147].) After the exposed PPy is removed, the gold layer can be wet etched directly (figure 11(e)).…”

Formation of Images and Surface Relief Gratings in Photosensitive Polymers Containing SCN Groups

“…These experiments were carried out with the aim to investigate dry development processes using O 2 -reactive ion etching (RIE). [21] PVBT films were UV irradiated (k = 254 nm) and exposed to an atmosphere containing (trimethylsilyl)-methylamine at 80 8C. However, in the UV illuminated zones of PVBT only a partial reaction of the NCS units to thiourea derivatives was achieved.…”

“…Generally, surface modification of photopatterned films of PVBT and PST-co-VBT with siliconorganic compounds may be a route to plasma developable resists using RIE. [21] At elevated temperatures (T l 80 8C), also with ammonia, ethylenediamine and propylamine some substitution of SCN groups occurred in unirradiated PST-co-VBT. However, under smooth reaction conditions (T f 50 8C, reaction time f 60 min) the addition of these amines to NCS units in the illuminated areas proceeded by far faster than the substitution of SCN units in the unirradiated areas.…”