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The state of the art of photosensitive polyimides is reviewed with respect to the incorporation of photosensitivity into both polyimide precursors and soluble polyimides, for patterning in positive and negative modes. This paper emphasizes, in particular, the discussion of the performance of commercially available photosensitive polyimides with respect to their applications in electronics. The decisive properties, especially the patterning performance, and in the case of precursors the curing conditions, required to obtain full imidization, thermomechanical and electrical properties, solvent resistance and water uptake, as well as planarization of the commercially available materials, are compared with each other. An outlook presents the future demands on photosensitive polyimides.

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The patterning of organic layer materials is often hindered by the effects of the conditions used to “develop” the resist material, for example high temperatures for strong bases, which attack the substrate. The process described here allows the patterning even of delicate layers of oriented nonlinear optical polymers. The figure shown a patterned polyimide film 115 μm thick.