The Use of 2D and 3D High-Speed Digital Image Correlation in Full Field Strain Measurements of Composite Materials Subjected to High Strain Rates

Abstract

Abstract:The aim of this paper is to assess and compare the performance of both high speed 2D and 3D digital image correlation (DIC) configurations in the characterization of unidirectional carbon fiber reinforced epoxy composites in high strain rate tension in the transverse direction. The criteria for assessment were in terms of strain resolution and measuring the strain localization within the gauge section. Results showed the high-speed 3D DIC technique has lower strain resolution compared to the high-speed 2D DIC technique. In addition, the analysis of the full strain fields indicated that the 3D DIC technique could accurately locate and measure the concentrations of strains within the gauge section of the tested samples.

Assessment of Strains Produced by Thermal Expansion in Printed Circuit Boards

“…According to documentation, digital image correlation (DIC) was successfully employed to determine the thermal deformations in many applications [ 13 , 14 , 15 , 16 , 17 , 18 , 19 ]. The DIC technique also was used for strain measurement on PCBs [ 20 , 21 , 22 ] and other composite materials [ 23 , 24 , 25 , 26 , 27 ].…”

Porosity variation of lithium-ion battery separators under uniaxial tension

“…However, most of the uniaxial tensile tests of separators used DIC in 2D mode via a single camera [8,10,13,14,18], which may cause measurement errors if the camera is not perfectly perpendicular to the sample surface [19] or the sample has small out-of-plane displacements [20]. In addition, the selection of the virtual strain gauge (VSG) length area may influence the DIC measurement [21] due to the non-uniform strain distribution in the VSG length area [10]. Moreover, strip-shaped samples were used in most studies according to ASTM D882, which, however, may sometimes cause wrinkling and non-uniaxial tension stress state during a test [13,22,23].…”