2021
DOI: 10.1016/j.apt.2021.05.053
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The wear and arc erosion behavior of novel copper based functionally graded electrical contact materials fabricated by hot pressing assisted electroless plating

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Cited by 93 publications
(11 citation statements)
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“…In particular, electroless plating is of great significance for improving the conductivity and service life span of some materials with high abrasive resistance requirements, such as electric contact materials. In addition, the core–shell structure composites prepared by electroless plating have good anti-fretting corrosion and anti-wear resistance properties 11 . Due to lack of catalytic sites, inert graphene does not possess autocatalytic activity, which generally needs to be pretreated by sensitization and an activation process during electroless plating, some complex technical problems still exist in these two-step processes 12 .…”
Section: Introductionmentioning
confidence: 99%
“…In particular, electroless plating is of great significance for improving the conductivity and service life span of some materials with high abrasive resistance requirements, such as electric contact materials. In addition, the core–shell structure composites prepared by electroless plating have good anti-fretting corrosion and anti-wear resistance properties 11 . Due to lack of catalytic sites, inert graphene does not possess autocatalytic activity, which generally needs to be pretreated by sensitization and an activation process during electroless plating, some complex technical problems still exist in these two-step processes 12 .…”
Section: Introductionmentioning
confidence: 99%
“…dendritic/electrolytic copper particles, the silver network was thinned and dispersed among the particle boundaries. The fact that silver metal has a more ductile and soft structure compared to copper and has a lower melting point encourages it to settle in the gaps that occur at the grain boundaries with the deformation during hot-pressing [42,43]. The microstructure of the C5 samples is composed of electroless silver-coated dendritic copper powders, in which all the particles used in the production of the samples by hot pressing, was given in Figure 4(e).…”
Section: Resultsmentioning
confidence: 99%
“…The fact that silver metal has a more ductile and soft structure compared to copper and has a lower melting point encourages it to settle in the gaps that occur at the grain boundaries with the deformation during hot-pressing [42,43]. The microstructure of the C5 samples is composed of electroless silver-coated dendritic copper powders, in which all the particles used in the production of the samples by hot pressing, was given in Since no silver-free particles were used in C5s, it was seen that the silver layer around all the dendrite branches was homogeneously distributed in the microstructure, as also understood from Figure 4(e ′ ).…”
Section: Microstructurementioning
confidence: 99%
“…For water transport experiments, the free-standing rGO films were placed on a clean glass substrate and silver electrodes were used as contact materials as shown in Figure 4a. Such a method of contacting the nanomaterial surface has been extensively used in the literature [25][26][27][28][29][30][31][32]. The fluid flow is along the longitudinal direction of the rGO film as indicated in Figure 4b.…”
Section: Device Fabrication and Setup For Flow Transport Experimentsmentioning
confidence: 99%