2012
DOI: 10.1016/j.ijmecsci.2012.01.001
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Theoretical analysis of forces in magnetorheological fluid based finishing process

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Cited by 92 publications
(34 citation statements)
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“…An experimental based study conducted by Sidpara and Jain [13] on magnetorheological fluid based finishing (MRFF) process revealed that the normal and tangential forces depended primarily on the working gap followed by concentration of CIP and wheel speed. Theoretical models for normal and tangential forces were also predicted by Sidpara and Jain [14] and Alam and Jha [7] for MRFF and BEMRF processes respectively. Singh et al [15] also proposed material removal mechanism and normal force associated with the working gap in BEMRF process.…”
Section: Introductionmentioning
confidence: 86%
“…An experimental based study conducted by Sidpara and Jain [13] on magnetorheological fluid based finishing (MRFF) process revealed that the normal and tangential forces depended primarily on the working gap followed by concentration of CIP and wheel speed. Theoretical models for normal and tangential forces were also predicted by Sidpara and Jain [14] and Alam and Jha [7] for MRFF and BEMRF processes respectively. Singh et al [15] also proposed material removal mechanism and normal force associated with the working gap in BEMRF process.…”
Section: Introductionmentioning
confidence: 86%
“…Recent studies [139][140][141][142] reported precisions in the order of nanometers in processing and surface roughnesses in the order of tenths of nanometers. The composite material used was based on an MR suspension along with abrasive microparticles such as silicon carbides, cerium oxide, etc., and the function of the material processed was examined.…”
Section: Ultrafine Polishingmentioning
confidence: 99%
“…Sidpara et al proposed a theoretical model of forces acting on the workpiece in MR fluid-based finishing process and carried out an experimental investigation to measure the forces on the freeform surface. The effect of size, concentration and type of abrasive particles as well as the size of magnetic particles on material removal rate and surface roughness of single crystal silicon were also investigated [3][4][5]. Sidpara and Li et al made some nano level finishing for semiconductor materials using magnetorheological finishing process and optimised the values of process parameters [6,7].…”
Section: Introductionmentioning
confidence: 99%