Theoretical calculation and Simulation of BGA package stress under temperature cycling load

Zhang, Yueping; Chao-zhen, Hou; Tong, Jun; Wang, Long

doi:10.1109/icept52650.2021.9568052

Cited by 2 publications

(1 citation statement)

References 2 publications

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“…According to the U.S. Air Force AVIP (Avionics Integrity Program), more than 20% of electronic product failures are attributed to vibration and shock, with solder joint failures being the most common [1,2]. Numerous studies have analyzed the stress and lifespan of solder joints in various environments [3,4,5,6,7,8,9,10,11], with most research utilizing the finite element method to evaluate the impact factors and lifespan of solder joints under vibration [12,13,14,15,16,17,18]. Some studies have also focused on parameter optimization for solder joints [19,20,21,22], employing various optimization methods [23,24,25].…”

Section: Introductionmentioning

confidence: 99%

Stress analysis and optimization of pop package under random vibration loading

Zhang,

Zhu,

Lian

et al. 2023

IEICE Electron. Express

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The stress analysis of packaging on packaging (POP) under random vibration loading is conducted using the finite element model. The effect of structural parameters on solder joint stresses is analyzed by sensitivity analysis. Stress fitting is performed using the response surface method (RSM), and the optimization module is used to optimize the structural parameters of POP packaging. The results demonstrate a reduction of 0.016 and 0.0031 MPa in upper and lower solder joint stresses, respectively. This optimization of the structural parameters improves the reliability of the electronic packaging structure.

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