Theory and application of microindentation in studies of glide and cracking in single crystals of elemental and compound semiconductors

Feltham, P.; Banerjee, R.

doi:10.1007/bf00542926

Cited by 78 publications

(24 citation statements)

References 19 publications

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“…For brittle materials, it is common observation that cracking occurs during indenter loading half--cycle. Feltham and Banerjee [20] first suggested that RISE might be released to the energy loss owing to the cracking of the specimens during indentation. Owing to such cracking, a fraction of energy is spent in crack propagation and a small indentation size results.…”

Section: Characterization Of the Resultant Sialonmentioning

confidence: 99%

Vickers and Knoop Indentation Microhardness Study of β-SiAlON Ceramic

Güder

Şahin

et al. 2011

Acta Phys. Pol. A

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In this paper, analysis and interpretation of mechanical property measurements of β-SiAlON ceramic were reported. Indentation microhardness of β-SiAlON ceramic was measured using the Knoop and Vickers indenters. The analysis of the Vickers indentation microhardness data reveals the reverse indentation size effect that is the apparent microhardness increases with increasing applied indentation test load. However, the Knoop indentation microhardness data exhibit indentation size effect that is the apparent microhardness increases with decreasing applied test load. The experimental Knoop microhardness data was analyzed using Meyer's law, elastic-plastic deformation model, proportional specimen resistance model, and Hays-Kendall's model. As a result, modified proportional specimen resistance model is found to be the most effective one for the load-independent (H LI ) microhardness determination of the SiAlON ceramic. It was seen that different models used to analyze the data obtained from the Vickers indentation do not give the same intrinsic hardness value. We also present the calculation of the Young modulus, E, of the β-SiAlON ceramic.

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Section: Characterization Of the Resultant Sialonmentioning

confidence: 99%

Vickers and Knoop Indentation Microhardness Study of β-SiAlON Ceramic

Güder

Şahin

et al. 2011

Acta Phys. Pol. A

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“…[28] For the Vickers indenter the parameter a = 2, for a Knoop indenter a = 4/p, while the best fit value b = 1/7 varies considerably in published data. Measurements for monocrystalline silicon at room temperature yield H = 10.6 ± 10.9 GPa [29,30] and K IC = 0.82, 0.9, and 0.95 MPa m 1/2 in the {111}, {110}, and {100} plane, respectively. In large grained polycrystalline silicon K IC = 0.75 MPa m 1/2 has been obtained.…”

Section: Single Particle Interaction and Fracture Mechanicsmentioning

confidence: 99%

Basic Mechanisms and Models of Multi‐Wire Sawing

Möller¹

2004

Adv Eng Mater

203

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More than 80 % of the current solar cell production requires the cutting of large silicon crystals. While in the last years the cost of solar cell processing and module fabrication could be reduced considerably, the sawing costs remain high, about 30 % of the wafer production. At present the large crystals are cut using the multi‐wire slicing technology[2] which has the advantage of a high throughput (several hundred wafers per day and machine), a small kerf loss of about 200 μm and almost no restrictions on the size of the ingots. Basic knowledge about the microscopic details of the sawing process is required in order to slice crystals in a controlled way. In the following the principles of the sawing process will be described in this review article as far as they are understood today.

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“…This is not taken into account in the different theoretical models of indentation plasticity [2,13,14]. The mean features of the mechanical behaviour of the crystal (hardness anisotropy, crack propagation) are generally explained in terms of the a/b asymmetry [1, 2, 15 to 17].…”

Section: Introductionmentioning

confidence: 99%