Thermal Analysis and Optimization of 6.4 W Si-Based Multichip LED Packaged Module

Abstract

BSTRACTMultichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

A Review of Light-Emitting Diodes and Ultraviolet Light-Emitting Diodes and Their Applications

“…The structural configurations of LEDs was focused on balancing compact, efficient internal layouts, and the management of heat density [52]. Researchers also investigated the influence of structural arrangements on controlling LED junction temperature, showing the importance of proper design considerations in this aspect [53]. The development of LED structures with improved thermal properties was a key focus, leading to advancements in thermal simulation and measurement techniques [54].…”