Thermal analysis of DC/DC module

Yuanchun, Wang; Ma, Weidong; Lu, Cai‐Cheng; Li, Zhiguo; Guo, Chunsheng; Fei, Li

doi:10.1109/ipfa.2009.5232619

Cited by 4 publications

(3 citation statements)

References 9 publications

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“…The influence of materials on the thermal behavior of the complete system is investigated by simulation [15]. The temperature of the schottky diode was decrease by 3.143℃ by moving inductance L1 to the other side of the transformer in the power supply module [16]. The thermodynamic behavior of the IGBT package was studied in [17], and the optimization design of IGBT by simulating the effect of per layer's thickness on the reliability of module was achieved.…”

Section: Introductionmentioning

confidence: 99%

“…And [19] analyzes the effects of factors such as thermal conductivity and interfacial thermal resistance of the thermal interface materials, solder bump patterns, solder ball patterns, thickness of the chips, the spacing between chips, flow velocity and liquid inlet temperature on the thermal performance of MCM. But [12][13][14][15][16][17][18][19] all have not given specific thermal optimization values. In recent years, response surface methodology (RSM) is introduced to characterize the thermal performance of MCM, and facilitate the thermal placement design of chips in MCM [20,21].…”

Section: Introductionmentioning

confidence: 99%

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Parametric Study in Thermal Optimization Design of Multi-Chip Module

Zhang¹,

Zhang²

2013

AMM

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A three dimensional model of Multichip Module (MCM) is built with ANSYS. The temperature and thermal stress field distribution are studied. Taking into account the global heat dissipation and the local thermal stress, the effect of structure parameters and material properties on the maximum chip junction temperature and the maximum thermal stress of MCM are studied. The four design parameters are the thickness of the substrate, thermal conductivity of the substrate, thermal conductivity of the thermal grease and convection heat transfer coefficient. This paper gave the method to reduce the temperature, and the results provided an efficient basis for the compromising design of thermal stress, which is benefit for the thermal optimization of MCM.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Parametric Study in Thermal Optimization Design of Multi-Chip Module

Zhang¹,

Zhang²

2013

AMM

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“…[1][2][3][4]In this paper, a detailed modeling method was presented to improve this defect. In the current model, the detailed geometry and material are embodied, including the heating area referenced as active area loading.…”

Section: Introductionmentioning

confidence: 99%

Thermal analysis of DC/DC power module based on innovative model with the application of active area loading

Pan

Liu

He³

et al. 2012

2012 13th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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Thermal simulation and analysis play a significant role in development of new generation of DC/DC package design and system integration. This paper presents an innovative model for thermal simulation and analysis with the application of active area loading. In traditional model, resistor, inductor, transformer and similar components are usually simplified into a homogeneous body with the same size of package outline. In the current model, the detailed geometry and material are embodied, including the heating area referenced as active area loading. And according to the manufacturing process used for the component, the height of active area is computed by equivalent method.For comparisons, the innovative model and traditional model were developed for the same DC/DC power module with the application of Pro/E software. And the thermal simulation and analysis were processed in the platform of ANSYS Workbench. Under the same boundary conditions and heat convection coefficient, the thermal distributions of DC/DC module were predicted in two models, and verified by infrared thermal images, which shows that the current model is more accurate.

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Optimal design of package structure of the hybrid integrated DC/DC power module based on orthogonal experimental method

Weng

Liu

et al. 2013

2013 14th International Conference on Electronic Packaging Technology

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The hybrid integrated DC/DC power modules are being used in many field, however, the operating temperature of the components becomes higher with the increasing density of the power module assembly. In this paper, orthogonal experimental design method is used to study the variation trend of DC/DC power module package thermal performance with combination of different package structure material and parameters, thus determining primary and secondary order of factor which has an influence on package heat dissipation and obtaining optimum combination of package structure parameters. The results of finite element simulation analysis shows that adopting the optimum combination of package structure parameters can decrease the chip's junction temperature.

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Thermal analysis of DC/DC module

Cited by 4 publications

References 9 publications

Parametric Study in Thermal Optimization Design of Multi-Chip Module

Parametric Study in Thermal Optimization Design of Multi-Chip Module

Thermal analysis of DC/DC power module based on innovative model with the application of active area loading

Optimal design of package structure of the hybrid integrated DC/DC power module based on orthogonal experimental method

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