Thermal analysis of droplet flow: Numerical, analytical and experimental investigations

Romano, M.; Guillaument, Romain; Hany, Cindy; Batsale, Jean Christophe; Pradère, Christophe

doi:10.1016/j.applthermaleng.2015.06.096

Cited by 4 publications

(2 citation statements)

References 43 publications

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“…In order to investigate the flow field during droplet impacting, spreading, oscillating, and solidifying on vertical substrates, a numerical model was established using the volume of fluid (VOF) method [24][25][26]. The mathematical principle of this simulation model is similar to our previous work [27,28].…”

Section: Numerical Approachmentioning

confidence: 99%

Insights into the impact and solidification of metal droplets in ground-based investigation of droplet deposition 3D printing under microgravity

Huang

Luo

et al. 2021

Applied Thermal Engineering

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Section: Numerical Approachmentioning

confidence: 99%

Insights into the impact and solidification of metal droplets in ground-based investigation of droplet deposition 3D printing under microgravity

Huang

Luo

et al. 2021

Applied Thermal Engineering

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“…Microchannel cooling and microjet impingement cooling continuously supply liquid convective flow or liquid jets into the hot zones, respectively, and waste heat is dissipated out of the chip as liquid flows out after the heat transfer process. Droplet-based microfluidic cooling techniques utilize discrete droplets [ 19 , 20 ] and liquid plugs [ 21 , 22 ] to remove waste heat from the hot zones. Since Tuckerman and Pease [ 23 ] first proposed using microchannel heat sinks to cool high-power-density electronic devices in 1981, the heat removal capacity of advanced thermal management systems has significantly enhanced from 100 W/cm 2 by forced-air convection up to 790 W/cm 2 .…”

Section: Introductionmentioning

confidence: 99%

Droplet-Based Microfluidic Thermal Management Methods for High Performance Electronic Devices

Yan

Jin

et al. 2019

Micromachines

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Advanced thermal management methods have been the key issues for the rapid development of the electronic industry following Moore’s law. Droplet-based microfluidic cooling technologies are considered as promising solutions to conquer the major challenges of high heat flux removal and nonuniform temperature distribution in confined spaces for high performance electronic devices. In this paper, we review the state-of-the-art droplet-based microfluidic cooling methods in the literature, including the basic theory of electrocapillarity, cooling applications of continuous electrowetting (CEW), electrowetting (EW) and electrowetting-on-dielectric (EWOD), and jumping droplet microfluidic liquid handling methods. The droplet-based microfluidic cooling methods have shown an attractive capability of microscale liquid manipulation and a relatively high heat flux removal for hot spots. Recommendations are made for further research to develop advanced liquid coolant materials and the optimization of system operation parameters.

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Numerical study of the thermocapillary droplet migration in a microchannel under a blocking effect from the heated upper wall

Chen

Nguyen

2017

Applied Thermal Engineering

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Thermal analysis of droplet flow: Numerical, analytical and experimental investigations

Cited by 4 publications

References 43 publications

Insights into the impact and solidification of metal droplets in ground-based investigation of droplet deposition 3D printing under microgravity

Insights into the impact and solidification of metal droplets in ground-based investigation of droplet deposition 3D printing under microgravity

Droplet-Based Microfluidic Thermal Management Methods for High Performance Electronic Devices

Numerical study of the thermocapillary droplet migration in a microchannel under a blocking effect from the heated upper wall

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