2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics 2013
DOI: 10.1109/aim.2013.6584072
|View full text |Cite
|
Sign up to set email alerts
|

Thermal analysis of piezoelectric benders with laminated power electronics

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Year Published

2018
2018
2020
2020

Publication Types

Select...
2
1

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
references
References 28 publications
0
0
0
Order By: Relevance