Thermal analysis on PCB using Galerkin approach

Soh, Mohd Norhisham Che; Bugis, Ismadi; Jamaludin, Irma Wani; Ranom, Rahifa

doi:10.1109/icmsao.2011.5775577

Cited by 3 publications

(1 citation statement)

References 9 publications

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“…The second boundary condition is applied on surface of the PCB where three heat losses occurred via convection, radiation and conduction [16][17]. The surface of the PCB is exposed to the environment.…”

Section: B One Dimensional Heat Transfermentioning

confidence: 99%

Numerical analysis of heat transfer on PCB current carrying conductor along with an interface

Norhisham

Ismadi

Wani

et al. 2011

2011 IEEE Conference on Open Systems

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This paper present a numerical one dimensional simulation of heat transfer on printed circuit board (PCB) current carrying conductor. A finite element method via Galerkin approach is applied to obtain the solution of heat transfer problem. A PCB has been designed and then an experiment has been performed for data collection. Analysis from the experiment data has been done and integrated with the simulation part. Both result from simulation and experiment is compared. The simulation result showed that there is a good agreement with the experimental result. It is proven that the algorithm can be applied to the heat transfer analysis of PCB. To show the result interactively, in this research there is a Graphical User Interface (GUI) developed for analysis of heat transfer.

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Section: B One Dimensional Heat Transfermentioning

confidence: 99%