Thermal and Crosstalk-Aware Physical Design for 3D System-On-Package

Minz, J.R.; Wong, Eric; Lim, Sung Kyu

doi:10.1109/ectc.2005.1441368

Cited by 10 publications

(4 citation statements)

References 21 publications

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“…Second, high-performance chips are vertically stacked, while the thermal resistance increases with the number of stacked chips. This is a common scenario in 3D package platforms such as TSV-SIP (through silicon via) and HBM [94][95][96][97][98][99][100][101][102][103]. These two categories of thermal management challenges are reviewed in Secs.…”

Section: Thermal Management Challenges In Heterogeneousmentioning

confidence: 99%

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Kim

Ren

Yuksel³

et al. 2020

Journal of Electronic Packaging

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Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to guide heat transfer in complex systems and new packaging approaches as related to thermal management of electronics. Such aspects are important, as trends of electronics packaging toward higher power, higher density, and 2.5D/3D integration are making thermal management even more challenging. While conventional cooling solutions based on large thermal-conductivity materials as well as heat pipes and heat exchangers may dissipate the heat from a source to a sink in a uniform manner, thermal metamaterials could help dissipate the heat in a deterministic manner and avoid thermal crosstalk and local hot spots. This paper reviews recent advances of thermal metamaterials that are potentially relevant to electronics packaging. While providing an overview of the state-of-the-art and critical 2.5D/3D-integrated packaging challenges, this paper also discusses the implications of thermal metamaterials for the future of electronic packaging thermal management. Thermal metamaterials could provide a solution to nontrivial thermal management challenges. Future research will need to take on the new challenges in implementing the thermal metamaterial designs in high-performance heterogeneous packages to continue to advance the state-of-the-art in electronics packaging.

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Section: Thermal Management Challenges In Heterogeneousmentioning

confidence: 99%

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Kim

Ren

Yuksel³

et al. 2020

Journal of Electronic Packaging

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“…Unlike the active physical design research effort in mixed signal SOC [4], [5] and 3-D stacked die technology [6]- [8], however, the research for 3-D SOP considerably lacks behind due to its short history. The physical design research for SOP has been recently pioneered by the [9]- [14]. Decoupling capacitor placement is done for two-dimensional (2-D) printed circuit board (PCB) designs [15]- [17].…”

Section: Related Workmentioning

confidence: 99%

Placement and Routing for 3-D System-On-Package Designs

Minz

Wong

Pathak

et al. 2006

IEEE Trans. Comp. Packag. Technol.

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Abstract-Three-dimensional (3-D) packaging via system-onpackage (SOP) is a viable alternative to system-on-chip (SOC) to meet the rigorous requirements of today's mixed signal system integration. In this article, we present the first physical design algorithms for thermal and power supply noise-aware 3-D placement and crosstalk-aware 3-D global routing. Existing approaches consider the thermal distribution, power supply noise, and crosstalk issues as an afterthought, which may require an expensive cooling scheme, more decoupling capacitors (=decap), and additional routing layers. Our goal is to overcome this problem with our thermal/decap/crosstalk-aware 3-D layout automation tools. The traditional design objectives such as performance, area, wirelength, and via are considered simultaneously to ensure high quality results. The related experimental results demonstrate the effectiveness of our approaches.Index Terms-Crosstalk, mixed-signal CAD, placement and routing, power supply noise, system-on-package (SOP), thermal distribution, three-dimensional (3-D) packaging.

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“…Advanced methods are utilized for global routing frequently. The most recent looks into on global routing is meant to upgrade diverse multi-target capacities related with execution and blockage, warm issues (Goplen & Sapatnekar, 2005), obstruction (Minz, Wong, & Lim, 2005), impediment mindful steering (Pandiaraj et al, 2017a;Ghosal, Das, & Das, 2012b) and so forth.…”

Section: Introductionmentioning

confidence: 99%

Thermal and congestion aware algorithm for 3D integrated circuits

Kadarkarai¹,

Sivakumar²

2021

3C Tecnología

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In VLSI physical Design methodology, Routing has been a most important in VLSI design, because the routing results are like circuit delay, power consumption, chip responsibility and manufacturability etc. With the advancements in 3D ICs, this issue has turned out to be substantially more complex. With the size of present-day plans at a huge number of nets, global routing has turned into a noteworthy computational test. The main purpose of the global routing is to reduce the wire length. In this work, a thermal and congestion aware formula is projected to attenuate the mixture wire length and to beat the congestion by systematically diffusive the nets within the routing region. The investigational output of the planned global router utilizes less wirelength and keeps far from congestion by ripping up and re-routing the nets. In future planned to use machine learning algorithm to reduce temperature between the layers in an integrated circuit.

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Thermal and Crosstalk-Aware Physical Design for 3D System-On-Package

Cited by 10 publications

References 21 publications

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Placement and Routing for 3-D System-On-Package Designs

Thermal and congestion aware algorithm for 3D integrated circuits

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