We investigated the effects of various fillers such as carbon nanotube (CNT), synthetic diamond (SND), boron nitride (BN), and copper (Cu) on the properties of polypropylene (PP) composites. The thermal conductivity and stability of PP were enhanced upon the addition of thermally conductive fillers. Young's modulus increased with filler loading, while tensile strength increased at up to 2 vol.% then decreased with elongation in all filler types. The morphology of the composite samples showed agglomeration and void content in PP/Cu composites, leading to the deterioration of thermal and mechanical properties at high-volume loading. Findings indicate that PP/ CNT has better thermal and mechanical properties compared with the other types of fillers.