1998
DOI: 10.1063/1.366692
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Thermal annealing of Pd/InAlAs Schottky contacts for transistor buried-gate technologies

Abstract: We studied the thermal reaction of Pd/In0.52Al0.48As contacts using capacitance–voltage (C–V), current–voltage, Auger electron spectroscopy, and x-ray diffraction analyses and compared the results to those for Pd/Al0.25Ga0.75As and Pd/In0.53Ga0.47As contacts. The thickness of InAlAs consumed by the reaction during annealing was calculated directly from the measured C–V profiles. Pd starts to react with InAlAs at a temperature of 100 °C, lower than it does with AlGaAs. For thermally annealed Pd/InAlAs and Pd/Al… Show more

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Cited by 12 publications
(7 citation statements)
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“…More importantly, the continuous diffusion of Pt is also a concern as device performance might degrade during successive heat treatment processes or during high-power operation [6]. In contrast, the diffusion of Pd saturates after thermal annealing [11]. Pd buried gate on InGaAs-AlGaAs structure has been extensively studied in the past, while there has only been a limited amount of works conducted on the InGaAs-InAlAs structure until recently [15].…”
Section: Iii-v Compound Semiconductors Have Long Been Recognizedmentioning
confidence: 99%
See 1 more Smart Citation
“…More importantly, the continuous diffusion of Pt is also a concern as device performance might degrade during successive heat treatment processes or during high-power operation [6]. In contrast, the diffusion of Pd saturates after thermal annealing [11]. Pd buried gate on InGaAs-AlGaAs structure has been extensively studied in the past, while there has only been a limited amount of works conducted on the InGaAs-InAlAs structure until recently [15].…”
Section: Iii-v Compound Semiconductors Have Long Been Recognizedmentioning
confidence: 99%
“…The Ti-gate device showed B = 0.56 eV and n = 1.59 when compared to the 5 nm and 10 nm Pd-gate devices which have B = 0.58 eV and B = 0.59 eV and n = 1.58 and n = 1.57, respectively. The increased B and n for the Pd-gate devices are attributed to the break-down of native oxides on the InAlAs surface during the heat treatment [11], therefore, leading to the reduction of off-state leakage.…”
Section: Effect Of Palladium Metal Thicknessmentioning
confidence: 99%
“…Researches on this ternary compound semiconductor were focused on In 0.52 Al 0.48 As whose lattice constant is matched to InP as well as In 0.53 Ga 0.47 As materials [4,5]. The detailed characteristics of these In 0.52 Al 0.48 As Schottky diodes with different metals were also extensively studied [5][6][7]. However, little has been published regarding the In 0.52 Al 0.48 As material system for microsensor application.…”
Section: Introductionmentioning
confidence: 98%
“…The metals that have previously been studied as gate metals include Ti [11][12][13][14], Pt [15][16][17] Pd [11,12,18], and Ir [19][20][21]. Pt exhibits the highest SBH (Schottky barrier height) Z0.8 eV on InAlAs, and has been widely used for the enhanced mode HEMT process.…”
Section: Introductionmentioning
confidence: 99%