Thermal behavior and electrical conductivity of poly(vinyl pyridine)/copper complexes

Rodrigues, J. R. S.; Gonçalves, Débora; Mangrich, A. S.; Soldi, V.; Bertolino, José Roberto; Pires, Alfredo T. N.

doi:10.1002/(sici)1098-2329(200022)19:2<113::aid-adv4>3.3.co;2-7

Cited by 10 publications

(16 citation statements)

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“…After polymerizing the 4VP monomer in the presence of the PTFE seed particles, whereas the spectrum of all the PTFE/P4VP surfactant complex latex nanoparticles was found to be different from that of PTFE. Along with the characteristic peaks of PTFE all the PTFE/P4VP/surfactant complex latex nanoparticles have shown additional bands at 1430 and 1470 cm −1 that can be assigned to skeletal vibration of (C=C) in pyridine and the characteristic pyridine ring vibrations of free uncoordinated rings was shifted to higher wave number from 1595 to 1605 cm −1 because of coordination of (N⃜M + ) in pyridine . Similarly, a further shift of these vibrations to1622 cm −1 was noticed on complexation with ZnCl 2 in Fig.…”

Section: Resultsmentioning

confidence: 64%

“…Nanocomposites of PTFE and P4VP surfactant complexes have shown enhancement of Tg in comparison to their corresponding P4VP complexes. Such behavior is indicative of strong interaction between the two components of the composite resulting in the hike . An increase in PFS concentration of the complex had shown enhancement in Tg.…”

Section: Resultsmentioning

confidence: 97%

“…Poly‐4‐vinyl pyridine (P4VP) is of interest because of its neutral basic nitrogen that allows network formation and enhanced inter chain electron transfers . P4VP is a perfect choice for surface modification of PTFE because reported literature has demonstrated that P4VP can be functionalized to form complexes with metal oxides and metals because of coordination bonding .…”

Section: Introductionmentioning

confidence: 99%

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Modification of PTFE latex with P4VP/Surfactant complexes at nanoscale

Reddy

Shailaja

2014

Polym Eng Sci

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Polytetrafluoroethylene (PTFE) latex nanoparticles were subjected to modification with Poly (4‐vinylpyridine) (P4VP) by in situ seeded emulsion polymerization technique using regular [sodium dodecyl sulfate (SDS)] and fluorinated [Potassium heptadecafluoro‐1‐octanesulfonate (PFS)]surfactants. The as prepared PTFE‐ (P4VP/surfactant complex) composite latex nanoparticles were characterized for structure, morphology, and thermal properties and a comparison of particles obtained by PFS and SDS was done with different W/W ratios of PTFE and 4VP monomer. The composites have shown a multistep degradation pattern that may be attributed to the P4VP, surfactant and PTFE backbone degradation. Lowering of crystal–crystal transition temperature of PTFE and increase in the glass transition temperature of the P4VP/PFS or SDS complexes was noticed in all the composites suggesting a homogeneous modification. Thus, a simple and easy way to modify PTFE has been reported which could be subsequently complexed with metal salts such that stringent high energy pretreatment methods like plasma, ozone, or irradiation techniques could be avoided. POLYM. ENG. SCI., 55:499–505, 2015. © 2014 Society of Plastics Engineers

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Section: Resultsmentioning

confidence: 64%

Section: Resultsmentioning

confidence: 97%

Section: Introductionmentioning

confidence: 99%

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Modification of PTFE latex with P4VP/Surfactant complexes at nanoscale

Reddy

Shailaja

2014

Polym Eng Sci

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“…4 For instance, the conducting and thermal properties of poly(4-vinylpyridine) (P4VP) are significantly changed when the polymer is complexed with copper ions. 5 The technological applications of the P4VP/ copper system include reactive blending, 6 catalyst, [7][8][9] cation exchange resins and membranes designed to preconcentrate metals from dilute solutions 10 or remove them from wastewater, 11 solid-state electrochemical cells, 12 circuit manufacturing on microscopic smoothly polymeric surfaces 13 and anti-corrosion methods. 14 Poly(4-vinylpyridine)/cupric salts complexes can be synthesized by physical mixing methods, and their thermal and spectroscopic properties are already known.…”

Section: Introductionmentioning

confidence: 99%

Protective effect of poly(4-Vinylpyridine) containing surface films to the corrosion of copper

Giacomelli¹,

Giacomelli²,

Schmidt³

et al. 2005

J. Braz. Chem. Soc.

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Neste trabalho investigou-se a capacidade de filmes de poli(4-vinilpiridina) (P4VP) em melhorar as propriedades de corrosão do cobre em H 2 SO 4 0,1 mol L -1 . Filmes que formam o complexo macromolecular Cu(P4VP) 2 (SCN) 2 foram obtidos por métodos eletroquímicos ou espontaneamente (por imersão) em soluções contendo 3% de ácido acético, KSCN 0,1 mol L -1 e P4VP. As características morfológicas dos filmes e o seu efeito sobre a corrosão do cobre foram analisados por técnicas de microscopia e eletroquímicas, respectivamente. Um aumento acentuado na resistência à corrosão de amostras de cobre recobertas por filmes de P4VP gerados espontaneamente foi observado em comparação às amostras não recobertas. A melhor condição para a obtenção destes filmes consiste na imersão do cobre em soluções contendo P4VP 0,1 mol L -1 durante 3 -4 h. Empregando-se esta metodologia, registraram-se eficiências de inibição (EI) de 94 -98%. Para filmes gerados eletroquimicamente, a EI foi de 70 -85%.We report here on the ability of poly(4-vinylpyridine) (P4VP) films to improve the copper corrosion properties in 0.1 mol L -1 H 2 SO 4 . Films formed by Cu(P4VP) 2 (SCN) 2 macromecularcomplex were electrochemically or spontaneously (by immersion) grown onto copper surfaces in 3% acetic acid, 0.1 mol L -1 KSCN and P4VP containing solutions. Imaging and electrochemical techniques were employed to characterize the film morphology and evaluate its effect on the copper corrosion, respectively. A substantial increase in corrosion resistance of copper samples spontaneously coated by P4VP films was found in comparison to the uncoated ones. The optimum conditions for spontaneous growth comprise a 3 -4 h immersion period in a 0.1 mol L -1 P4VP containing solution. Inhibition efficiencies (IE) of 94 -98% were recorded by employing this methodology. For electrochemically grown P4VP films, the IE was 70 -85%. Keywords: poly(4-vinylpyridine), corrosion, copper IntroductionThe use of d-block metals to produce coordination complexes in polymer blends has been studied over the past few decades. 1 By physically mixing transition-metals cations and coordinating polymers, it has been possible to obtain materials with properties different from those of the individual bulk components. 2,3 Recently, the importance of developing macromolecular complexes was highlighted because of their optical, magnetic, electronic and solution properties. 4 For instance, the conducting and thermal properties of poly(4-vinylpyridine) (P4VP) are significantly changed when the polymer is complexed with copper ions. 5 The technological applications of the P4VP/ copper system include reactive blending, 6 catalyst, 7-9 cation exchange resins and membranes designed to preconcentrate metals from dilute solutions 10 or remove them from wastewater, 11 solid-state electrochemical cells, 12 circuit manufacturing on microscopic smoothly polymeric surfaces 13 and anti-corrosion methods. 14 Poly(4-vinylpyridine)/cupric salts complexes can be synthesized by physical mixing methods, and their therma...

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“…7 The polymer poly(4-vinylpyridine) (P4VP) exhibited different thermal and conducting properties as a [P4VP]/copper iodide binary mixture; the electrical conductivity changes drastically with the increase in the amount of copper iodide in the blends. 8 Specifically, the couple P4VP/copper has been focused elsewhere 1,3,6,10-15 due its great potential for applications such as in reactive blending, 6 catalyst for determination and oxidation of ascorbic acid 9 and the technically important oxidative polymerization of 2,6-dimethylphenol 1 in addition to the selective conversion of 2,3,6-trimethylphenol and related compounds to p-benzoquinones, 10 cation exchange resins designed to remove or preconcentrate metals from dilute solutions by binding them to soluble polymers, 11 solid-state electrochemical cells, 12 anti-corrosion methods 13 and circuit manufacturing on microscopic smoothly polymeric surfaces or production of polymeric films on metallic surfaces. 14 Consequently, the importance in obtaining P4VP/copper films onto copper surfaces for technological development is clear.…”

Section: Introductionmentioning

confidence: 99%

Interaction of poly(4-vinylpyridine) with copper surfaces: electrochemical, thermal and spectroscopic studies

Giacomelli¹,

Giacomelli²,

Santana

et al. 2004

J. Braz. Chem. Soc.

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A interação do polímero poli(4-vinilpiridina) (P4VP) e íons tiocianato com cobre em soluções ácidas foi estudada através de voltametria cíclica, termogravimetria, análise elementar e espectroscopia na região do infravermelho. Observou-se que os íons Cu(I) eletrogerados em ca. -0,45 V/ECS na superfície do eletrodo promovem uma reação de complexação com P4VP e SCN -, ambos presentes em solução. O complexo polimérico eletroativo resultante cresce sobre a superfície do eletrodo como um filme e o centro metálico é oxidado para Cu(II) numa etapa subseqüente em ca. -0,23 V/ECS. De acordo com os resultados termogravimétricos, o complexo obtido é menos estável do que o P4VP puro, conforme indicado pelo abaixamento da temperatura inicial de degradação de ca. 400 ºC (P4VP) para ca. 200 ºC (complexo). A análise elementar do filme revelou uma composição química de 2:1:2 para P4VP:Cu:SCN -e os espectros na região do infravermelho indicaram que tal complexo polimérico é formado por um centro metálico de cobre coordenado pelos átomos de nitrogênio dos anéis piridínicos e íons tiocianato.The interaction of poly(4-vinylpyridine) (P4VP) and thiocyanate ions with copper in acid solutions was studied by cyclic voltammetry, thermogravimetry, elemental analysis and infrared spectroscopy. It is shown that at ca. -0.45 V/SCE the electrogenerated Cu(I) ions at the surface of a copper electrode induce a complexing reaction with P4VP and SCN -both present in solution. The resulting electroactive polymer-complex grows onto the electrode surface as a film, and the metallic center is further oxidized to Cu(II) in a subsequent step at ca. -0.23 V/SCE. According to thermogravimetric results, the polymer-complex is less thermally-stable than P4VP as evidenced by the lowering in the initial temperature of degradation from ca. 400 ºC (P4VP) to ca. 200 ºC (complex). The elemental analysis revealed a chemical composition of 2:1:2 for P4VP:Cu:SCN, and the infrared spectra indicated that the complex comprises a copper metallic center coordinated with nitrogen pyridinic rings (P4VP) and thiocyanate ions.

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Thermal behavior and electrical conductivity of poly(vinyl pyridine)/copper complexes

Cited by 10 publications

References 0 publications

Modification of PTFE latex with P4VP/Surfactant complexes at nanoscale

Modification of PTFE latex with P4VP/Surfactant complexes at nanoscale

Protective effect of poly(4-Vinylpyridine) containing surface films to the corrosion of copper

Interaction of poly(4-vinylpyridine) with copper surfaces: electrochemical, thermal and spectroscopic studies

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