2019
DOI: 10.1016/j.microrel.2019.01.002
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Thermal behaviors of nanoparticle reinforced epoxy resins for microelectronics packaging

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Cited by 16 publications
(13 citation statements)
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“…In addition to the focus on designing appropriate curing agent, also proposed the use of nano-silica (NS) to improve the weakness of organic materials. According to the previous report, the NS particles uniformly distributed in the epoxy resin can improve the mechanical, thermal stability, and abrasion resistance of the polymer matrix which probably enhances the anti-sliding durability of AS layer [23][24][25]. Thus, our results show that the combination of these design concepts leads to form a new epoxy-based composite material with a strong potential to serve the application of anti-sliding.…”
Section: Introductionsupporting
confidence: 66%
See 1 more Smart Citation
“…In addition to the focus on designing appropriate curing agent, also proposed the use of nano-silica (NS) to improve the weakness of organic materials. According to the previous report, the NS particles uniformly distributed in the epoxy resin can improve the mechanical, thermal stability, and abrasion resistance of the polymer matrix which probably enhances the anti-sliding durability of AS layer [23][24][25]. Thus, our results show that the combination of these design concepts leads to form a new epoxy-based composite material with a strong potential to serve the application of anti-sliding.…”
Section: Introductionsupporting
confidence: 66%
“…Figure 4(a) presents the FTIR characterization of the compounds in each step of our proposed synthetic routes. The absorption peaks at 1607 cm −1 and 1509 cm −1 are the characteristic peaks of the benzene ring in the epoxy resin [24]. Comparing the spectrum (a) and (b), the peak intensity of the epoxy group at 915 cm −1 is significantly reduced, and this owes to ring-opening of the epoxy group induced by the active hydrogen.…”
Section: Effect Of E44 and Pde Ratio On Physical Performance Of Wersmentioning
confidence: 96%
“…The water absorption of Al 2 O 3 /PU and PDA-Al 2 O 3 /PU composites was calculated. According to GB/T 1462-2005, the dry sample was immersed in water at 23 • C for 24 h to test the water absorption percentage relative to the sample mass [36]. The average of the water absorption of five samples was the final water absorption.…”
Section: Methodsmentioning
confidence: 99%
“…A humid environment will also affect the performance of electronic packaging to some extent [36]. When electronic packaging absorbs too much moisture, the insulation property of the composites decreases, which affects the service life.…”
Section: Water Absorptionmentioning
confidence: 99%
“…Besides, due to the high thermal conductivity of SiO 2 , the heat could quickly transfer to environment to decrease chip temperature when the chip was under operation and thus to prolong the failure time of chip. 10 Arulmurugan et al applied dynamic mechanical analysis (DMA) to study the influence of BaSO 4 on the properties of woven natural fiber reinforced epoxy composites. Results showed that the glass transition temperature (T g ) of composite was improved due to the molecular mobility were enhanced and the bond between fiber and matrix was minimized by addition of BaSO 4 fillers.…”
mentioning
confidence: 99%