Thermal benchmark of a classic and novel embedded high-power 3-phase inverter Bridge

Abstract

A 3-phase high power inverter bridge for a 500 W PEDELEC motor fabricated using a novel embedding technology was benchmarked against a classically designed module using MOSFETs in a B6 Bridge. By operating each MOSFET individually in reverse mode and measuring the forward voltage during high current operation and after switching to a measuring current of 50 mA the junction temperature has been measured. Equivalent thermal resistances used for comparison have been calculated. By reverse modelling the thermal behaviour of the entire module including the MOSFETs' junction temperatures at full operation has been established. The study is extended to an embedded 50kW-demonstrator design for electric vehicle applications where the thermal resistances were studied and the maximum allowable boundary conditions predicted by simulation

Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development

“…Alumina-loaded materials can achieve up to 5 W m −1 K −1 [55], but they are sensitive to the growth of conductive anode filaments, which may cause short circuits [39]. Thicker copper conductors can provide better heat spreading [56] and increase the current carrying capability of the PCB (Fig. 3g).…”