Thermal boundary resistance

Swartz, Ed; Pohl, Robert Wichard

doi:10.1103/revmodphys.61.605

Cited by 2,594 publications

(2,082 citation statements)

References 267 publications

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“…Heat transfer at the interface of two different materials mostly happens with a temperature discontinuity [242]. This phenomenon was observed first at the interface of a metal and liquid helium [243], while later it has been found at the interface of two solids [244]. The heat loss at the interface of two different materials is due to the phonon scattering at this region [236,238,239].…”

Section: Thermal Conductivitymentioning

confidence: 96%

A review on the role of interface in mechanical, thermal, and electrical properties of polymer composites

Kashfipour

Mehra

Zhu

2018

Adv Compos Hybrid Mater

173

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Composite materials and especially polymer composites are widely used in daily life and different industries due to their vastly different properties and design flexibility. It is known that the properties of the composites are strongly related to the properties of its constituents. However, it has been reported in many studies, experimentally and by simulations, that the characteristics of the composites do not follow the rule of mixing. It means that in addition to properties of the constituents, there are other parameters affecting the final physicochemical properties of composites. The interfacial interactions between fillers and host is one of the factors which can strongly affect the properties of the composite. In this review, we summarized the type of interactions between the constituents, their improvement techniques, interaction measurement methods, and the effects of interfacial interactions on thermal, mechanical, and electrical properties of composites.

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Section: Thermal Conductivitymentioning

confidence: 96%

A review on the role of interface in mechanical, thermal, and electrical properties of polymer composites

Kashfipour

Mehra

Zhu

2018

Adv Compos Hybrid Mater

173

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“…It is reasonable to assume that, for rough interfaces, the scattering becomes diffusive: Carriers lose the memory about their path, and they get scattered in all directions with equal probability. This picture, forming the basis of the ''diffusemismatch model'' of phonon transport, has been employed with success for understanding the thermal conductance of solid-solid interfaces [24][25][26][27]. Thus, it is reasonable to assume a similar diffusive-scattering ansatz for the limiting effect of grain boundaries on charge transport: The carrier mean free path (MFP), , becomes of the order of the grain size, L. For grains smaller than the MFP of the bulk, one can approximate ' L. Contrary to the constantrelaxation-time approximation, this assumption, called the constant-mean-free-path approximation, is based on physical grounds.…”

Section: Introductionmentioning

confidence: 99%

Assessing the Thermoelectric Properties of Sintered Compounds via High-ThroughputAb-InitioCalculations

et al. 2011

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Several thousand compounds from the Inorganic Crystal Structure Database have been considered as nanograined, sintered-powder thermoelectrics with the high-throughput ab-initio AFLOW framework. Regression analysis unveils that the power factor is positively correlated with both the electronic band gap and the carrier effective mass, and that the probability of having large thermoelectric power factors increases with the increasing number of atoms per primitive cell. Avenues for further investigation are revealed by this work. These avenues include the role of experimental and theoretical databases in the development of novel materials.

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“…4 Such a temperature jump is described by the interface thermal resistance, thermal boundary resistance (TBR), or Kapitza resistance, owing to Kaptiza's original work. 1 With temperature 1 T and 2 T at the two sides of the interface, and heat flux q (W/m 2 ) flowing across the interface, the thermal boundary resistance (R) can be written as,…”

Section: Introductionmentioning

confidence: 99%

“…[1][2][3] When phonons transport across a material interface, they experience reflection, transmission, and mode conversion, which results in a local temperature jump at the interface. 4 Such a temperature jump is described by the interface thermal resistance, thermal boundary resistance (TBR), or Kapitza resistance, owing to Kaptiza's original work.…”

Section: Introductionmentioning

confidence: 99%

Effect of lattice mismatch on phonon transmission and interface thermal conductance across dissimilar material interfaces

Yang

2012

Phys. Rev. B

139

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When phonons transport across a material interface, they experience reflection, transmission and mode conversion, which results in a local temperature jump at interface and thus dramatically changes the thermal conductivity of nanostructured materials. Phonon transmission across lattice-matched interfaces has been studied extensively in recent years with the atomistic Green's function (AGF) approach, which usually uses one unit cell to represent the cross-section along the interface. However, modeling phonon transmission across realistic material interfaces is much more challenging because realistic interfaces are usually latticemismatched ones with atomic reconstruction, defects, and species mixing, which demands a larger cross-sectional area for the AGF simulation. In this paper, an integrated molecular dynamics (MD) and AGF approach is developed to study the phonon transmission across latticemismatched interfaces. MD simulation is used to simulate atomic reconstruction close to the 1 Email: Ronggui.Yang@Colorado.Edu interface. The recursive AGF approach is then employed for the first time to calculate frequencydependent phonon transmission across lattice-mismatched interfaces with defects and species mixing, which addresses the numerical challenge in calculating phonon transmission for a relatively large cross-sectional area with reduced computational cost. The study of the relaxed interface formed from two semi-infinite bulk materials shows that lattice mismatch increases the lattice disorder and decreases the adhesion energy, which in turn lowers phonon transmission and reduces the interface thermal conductance across lattice-mismatched interfaces. Low-frequency phonons can be significantly scattered by increasing the defect size across the interface while high frequency phonons can be scattered almost completely (phonon transmission <0.1) across an alloyed layer as thin as 2.27 nm. The effect of lattice-mismatch on phonon transmission becomes smaller for interfaces with defects and species mixing. The effect of annealing temperature on the Si/Ge interface thermal conductance was studied. A significant reduction of the Si/Ge interface thermal conductance was observed for a lattice-mismatched interface when annealed at high temperature, which agrees well with the available experimental data in literature.

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Thermal boundary resistance

Cited by 2,594 publications

References 267 publications

A review on the role of interface in mechanical, thermal, and electrical properties of polymer composites

A review on the role of interface in mechanical, thermal, and electrical properties of polymer composites

Assessing the Thermoelectric Properties of Sintered Compounds via High-ThroughputAb-InitioCalculations

Effect of lattice mismatch on phonon transmission and interface thermal conductance across dissimilar material interfaces

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