Thermal characterization of a liquid cooled AlSiC base plate with integral pin fins

Moores, K.A.; Joshi, Yogendra; Schiroky, G. H.

doi:10.1109/6144.926385

Cited by 19 publications

(6 citation statements)

References 5 publications

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“…With the rapid progress of high-speed computing, computational fluid dynamics (CFD) has been frequently used to predict convection heat transfer in pin/plate-fin heat sinks (Galvis et al, 2008;Naphon and Sookkasem, 2007;Moores et al, 2001). With uniform thermal boundary conditions applied at the heat sink substrate, only a unit pin-fin or a column of pin-fins needs to be included in the CFD calculation by imposing the symmetric and periodic boundary conditions.…”

Section: Convection In Pin/plate-fin Heat Sinksmentioning

confidence: 99%

Numerical investigation of forced convection in pin/plate‐fin heat sinks heated by impinging jet using porous medium approach

Feng

Kim

2013

International Journal of Numerical Methods for Heat &Amp; Fluid Flow

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Purpose -The purpose of this paper is to present a porous medium model for forced air convection in pin/plate-fin heat sinks subjected to non-uniform heating of a hot gas impinging jet. Parametric studies are performed to provide comparisons between inline square pin-fin and plate-fin heat sinks in terms of overall and local thermal performance for a fixed pressure drop. Design/methodology/approach -Heat conduction in substrates is coupled with forced convection in the pin/plate-fin flow channel. The forced convection is considered by employing the non-Darcy model for fluid flow and the thermal non-equilibrium model for heat transfer. A series of experiments is performed to validate the model for both the pin-fin and plate-fin heat sinks. Findings -The present porous medium model is capable of capturing the presence of lateral heat spreading in the plate-fins and the absence of lateral heat spreading in the pin-fins under non-uniform thermal boundary condition, attributing to the adoption of the orthotropic effective thermal conductivity for the solid phase in the energy equation. The present results show that the inline square pin-fin heat sink has topological advantage over the plate-fin heat sink, although the heat spreading through the plate-fins on reducing the peak temperature on the substrate is pronounced. Originality/value -This paper reports an original research on theoretical modeling of forced convection in pin/plate-fin heat sinks subjected to the non-uniform heating of an impinging jet.

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Section: Convection In Pin/plate-fin Heat Sinksmentioning

confidence: 99%

Numerical investigation of forced convection in pin/plate‐fin heat sinks heated by impinging jet using porous medium approach

Feng

Kim

2013

International Journal of Numerical Methods for Heat &Amp; Fluid Flow

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“…Thus, works on the forced convection design and the optimization of parallel-plate heat sinks have been extensively conducted up to date [2], [3]. In an effort to enhance heat dissipation, recently, some studies have been performed concerning various types of heat sinks such as the strip-fin, the skive-fin, the pin-fin heat sink and so forth [2], [4]- [6]. By using foam metals, several studies considered porous-type heat sinks and reported a substantial heat transfer enhancement [7]- [10].…”

Section: Nomenclaturementioning

confidence: 99%

Thermal performance of aluminum-foam heat sinks by forced air cooling

Kim

Paek

Kang

2003

IEEE Trans. Comp. Packag. Technol.

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Experiments have been carried out to investigate the heat transfer characteristics from aluminum-foam heat sink placed on a heat source in a channel. Thermal performance of aluminum-foam heat sinks is evaluated in terms of the Nusselt number and thermal resistance of heat sinks. The pore density of aluminum-foam heat sinks and the Reynolds number are varied in the range of the parameters: 10, 20, 40 pores per inch (PPI) and 710 2900, respectively. It is found that thermal resistance is substantially reduced by employing an aluminum-foam heat sink with low pore density due to relatively intense airflow through the heat sink. The aluminum-foam heat sink may provide 28% or higher thermal performance than a conventional parallel-plate heat sink of the same size. Further, the aluminum-foam heat sinks can dramatically reduce the overall mass of electronics-cooling devices owing to high porosity.

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“…Usually these special base plates are made of copper, the same material used in conventional base plates [7]. In [8], such a cold plate has been made of AlSiC, which offers higher reliability under extreme temperature operating conditions. Other advancement in cooling efficiency is the use of direct cooling.…”

Section: Introductionmentioning

confidence: 99%

A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling

Liang

Ning

Wang

et al. 2014

IEEE J. Emerg. Sel. Topics Power Electron.

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A multilayer planar interconnection structure was used for the packaging of liquid-cooled automotive power modules. The power semiconductor switch dies are sandwiched between two symmetric substrates, providing planar electrical interconnections and insulation. Two minicoolers are directly bonded to the outside of these substrates, allowing doublesided, integrated cooling. The power switch dies are orientated in a face-up/face-down 3-D interconnection configuration to form a phase leg. The bonding areas between the dies and substrates, and the substrates and coolers are designed to use identical materials and are formed in one heating process. A special packaging process has been developed so that high-efficiency production can be implemented. Incorporating high-efficiency cooling and low-loss electrical interconnections allows dramatic improvements in systems' cost, and electrical conversion efficiency. These features are demonstrated in a planar bond-packaged prototype of a 200 A/1200 V phase-leg power module made of silicon (Si) insulated gate bipolar transistor and PiN diodes.

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Thermal characterization of a liquid cooled AlSiC base plate with integral pin fins

Cited by 19 publications

References 5 publications

Numerical investigation of forced convection in pin/plate‐fin heat sinks heated by impinging jet using porous medium approach

Numerical investigation of forced convection in pin/plate‐fin heat sinks heated by impinging jet using porous medium approach

Thermal performance of aluminum-foam heat sinks by forced air cooling

A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling

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