1994
DOI: 10.1049/el:19940589
|View full text |Cite
|
Sign up to set email alerts
|

Thermal comparison of long-wavelength vertical-cavitysurface-emitting laser diodes

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
15
0

Year Published

1995
1995
2010
2010

Publication Types

Select...
4
3
1

Relationship

0
8

Authors

Journals

citations
Cited by 32 publications
(15 citation statements)
references
References 7 publications
0
15
0
Order By: Relevance
“…The temperature dependent device parameters tj, , and 'th change with rising current I and affect the emitted light power P(I) = h c0 i (I -IIh) / e (16) The influence •f the heat source distribution on the resulting P1 curves is shown in Fig. 10 But, comparing curve (a) in Fig.…”
Section: Light Powermentioning
confidence: 99%
See 1 more Smart Citation
“…The temperature dependent device parameters tj, , and 'th change with rising current I and affect the emitted light power P(I) = h c0 i (I -IIh) / e (16) The influence •f the heat source distribution on the resulting P1 curves is shown in Fig. 10 But, comparing curve (a) in Fig.…”
Section: Light Powermentioning
confidence: 99%
“…Dielectric bottom mirrors, e.g., Si/Si02 within a hole etched into the substrate need only a few layers, but the thermal resistance in top-down mounting is high, too. 16 Material choices for dielectric top DBRs mostly include amourphous Silicon with high refractive index but low thermal conductivity and high optical absorption. Thus, SiC was proposed'7 to replace Si.…”
Section: Device Considerationsmentioning
confidence: 99%
“…3 (2001) The maximum temperature rise for a 10 mm VCSEL with a 3/4 l-cavity is 8.3 K leading to a thermal resistance of 4150 KW --1 . This value is about four to five times larger than calculated resistances of long-wavelength VCSELs with comparable diameter and AlAs/GaAs Bragg mirrors [10]. The 5 mm BTJ-VCSEL with the same cavity length shows a temperature rise of 4.9 K. For an optical cavity length of 5/4 l, this value is lowered to 3.6 K. The corresponding thermal resistances are 5760 KW --1 and 4230 KW --1 , respectively.…”
Section: Thermal Device Resistancementioning
confidence: 85%
“…When grown using InP/InGaAsP, VCSELs have poor performance due to the high thermal sensitivity and refractive index properties of the materials. 1 One of the most promising, albeit complex, approaches has been to use wafer fusion, in which the active region grown on an InP substrate and the distributed Bragg reflectors grown on GaAs are bonded together to form the VCSEL. 2 In order to ensure reliability and reproducibility, and to overcome the limitations of the InP/InGaAsP material system, there is interest in developing alternative structures based on GaAs, especially since GaAs-based technology is generally more advanced than that of InP.…”
mentioning
confidence: 99%