Thermal conductance of metallic contacts in a vacuum

Fried, Erwin; Kelley, Michael

doi:10.2514/6.1965-661

Cited by 26 publications

(5 citation statements)

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“…Inserting such interposers, commonly improves the thermal conductance of bare joints by one to two orders of magnitude. A significant increase of conductance has been shown in many studies [3,9,10,134,137,163,180,[185][186][187][188][189][190][191][192][193][194][195][196][197][198][199][200][201][202][203] (more citations in [163]). Indium foils and filled silicon greases (for example Apiezon-N) appear to be the most suitable interposers for improving the performance of thermal contacts.…”

Section: Interposers and Enhancement Of Contact Conductancementioning

confidence: 99%

“…Often metal powders (Cu, Ag, SS, Ni) are used as fillers in grease or epoxy-like compounds, to improve the thermal performance. Examples are Stycast-FT2850 (with Cu powder as filler), and Cryocon grease (with Cu as filler) for use at low temperature, and Cu, Ni, SS diluted in any grease for room temperature [37,38,96,180,[185][186][187][188][189][190][191].…”

Section: Interposers and Enhancement Of Contact Conductancementioning

confidence: 99%

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Thermal boundary resistance of mechanical contacts between solids at sub-ambient temperatures

Gmelin

Asen-Palmer

Reuther

et al. 1999

J. Phys. D: Appl. Phys.

122

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The experimental values of the thermal boundary resistance occurring at interfaces between two solids at sub-ambient temperatures are reviewed. New data are presented in the temperature range from 4 K to 300 K for the thermal resistance between different metals (Cu, stainless steel), interlayered by various cryogenic bonding agents (Apiezon-N, Cryocon grease, In and InGa), or mechanically connected (dry) contacts. Depending on the contact materials, the thermal conductance varies between 10 2 W m −2 K −1 and 5 × 10 4 W m −2 K −1 at room temperature, and decreases approximately linearly by one order of magnitude between 200 K and 20 K. Our experimental data agree well with the data reported in the literature for the temperature range below 4 K and measurements near room temperature.

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Section: Interposers and Enhancement Of Contact Conductancementioning

confidence: 99%

Section: Interposers and Enhancement Of Contact Conductancementioning

confidence: 99%

Thermal boundary resistance of mechanical contacts between solids at sub-ambient temperatures

Gmelin

Asen-Palmer

Reuther

et al. 1999

J. Phys. D: Appl. Phys.

122

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“…The thermal contact conductance of oxygen-free high conductivity (OFHC) copper in dependence of the contact pressure is measured in [24] and compared to the data of [25]. Again a power function is used for the fit of the thermal contact conductance to the experimental data from [24] κ C,th,…”

Section: Electrical and Thermal Contact Conductivitymentioning

confidence: 99%

Field assisted sintering technology. Part I: Experiments, constitutive modeling and parameter identification

et al. 2016

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Field-assisted sintering technology (FAST), also well-known under the term spark-plasma sintering (SPS), is a grown process technology to produce parts made of a powder material. The process itself has the advantage of carrying out compaction, sintering and cooling with high temperature rates in one process step. This is done using an electrical current, which heats the graphite tools and, accordingly, the powder within the die itself. The theoretical description itself is very complicated caused by the fact of having electro-thermomechanical coupling effects, large deformations, contact problems for each field, but the essential point are the amount of experiments required to determine the parameters of the model. In this article, the required experiments to obtain the electrical, thermal and mechanical properties of both materials are discussed, a constitutive model of compressible thermo-viscoplasticity for copper powder is proposed, and aspects of material parameter identification are addressed.

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“…During these years, numerous experimental investigations were reported in the literature. Among them, the most representative are Martin's experimental apparatus, Lambert and Fletcher's experimental apparatus [1,2] , Yovanovich's experimental apparatus [3] , Xu Lie's experimental apparatus [4] and Rosochowska's experimental apparatus [5] . Besides, a number of models and empirical and semi-empirical correlations to predict TCC were proposed.…”

Section: Introductionmentioning

confidence: 99%

An Experimental Setup to Test Thermal Contact Conductance Across Solid/Solid Interface

Liu

Zhang

Tang

2011

AMR

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This article describes an experimental setup to measure the TCC between interfaces of two contact solid materials. This apparatus consists of loading and load bearing subsystem, water-cooling subsystem, heating subsystem, temperature measurement and control subsystem and thermal insulation subsystem. A new kind of design scheme of the compensation heater is put forward. An experimental investigation of TCC is conducted with pressed pairs of TC4/30CrMnSi contacts in the range 40~140MPa. The results show that TCC over this condition increases with load, and is greater in the process of unloading than that of loading under the same condition.

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Thermal conductance of metallic contacts in a vacuum

Cited by 26 publications

References 0 publications

Thermal boundary resistance of mechanical contacts between solids at sub-ambient temperatures

Thermal boundary resistance of mechanical contacts between solids at sub-ambient temperatures

Field assisted sintering technology. Part I: Experiments, constitutive modeling and parameter identification

An Experimental Setup to Test Thermal Contact Conductance Across Solid/Solid Interface

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