Thermal Conductance of Metallic Contacts in a Vacuum

Fried, Erwin; Kelley, Maurice J.

doi:10.1016/b978-0-12-395736-8.50041-9

Cited by 7 publications

(1 citation statement)

References 4 publications

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“…The thermal contact conductance measured across OFHC copper contacts in the present set-up is compared with Fried and Kelley (1966) data collected for the same material having the same surface roughness (0.2 µm) in figure 5. The results are in good agreement in the range of 0-10 MPa contact pressures.…”

Section: Performancementioning

confidence: 99%

Instrumentation to measure thermal contact resistance

Rao

Bapurao

Nagaraju³

et al. 2003

Meas. Sci. Technol.

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Instrumentation was developed to measure the thermal contact resistance across metallic contacts by varying the contact pressure in different environments. Experiments were conducted on oxygen free, high conductivity (OFHC) copper cylindrical flat contacts and the measured thermal contact resistance is in good agreement with the theoretical models reported in the literature. The thermal conductivity of OFHC copper and stainless steel was measured at different temperatures and these values are in good agreement with the literature values.

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Section: Performancementioning

confidence: 99%

Instrumentation to measure thermal contact resistance

Rao

Bapurao

Nagaraju³

et al. 2003

Meas. Sci. Technol.

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Field assisted sintering technology. Part I: Experiments, constitutive modeling and parameter identification

et al. 2016

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Field-assisted sintering technology (FAST), also well-known under the term spark-plasma sintering (SPS), is a grown process technology to produce parts made of a powder material. The process itself has the advantage of carrying out compaction, sintering and cooling with high temperature rates in one process step. This is done using an electrical current, which heats the graphite tools and, accordingly, the powder within the die itself. The theoretical description itself is very complicated caused by the fact of having electro-thermomechanical coupling effects, large deformations, contact problems for each field, but the essential point are the amount of experiments required to determine the parameters of the model. In this article, the required experiments to obtain the electrical, thermal and mechanical properties of both materials are discussed, a constitutive model of compressible thermo-viscoplasticity for copper powder is proposed, and aspects of material parameter identification are addressed.

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