Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution‐cast method

Abstract

Organosoluble polyimide (PI)/ceramic composite films with different BN or (BN + AlN) contents were under investigation for their thermal conductive performances. The chosen polyimide constituted by 4,4′‐oxydiphthalic dianhydride/2,2‐bis(3‐amino‐4‐hydroxyphenyl)hexafluor opropane could be dissolved and cast into thin films at room temperature. The commercially available BN and AlN fillers up to a volume ratio of 0.6 were added to the polyimide and their thermal conductive performances were measured. BN powders needed a surface precoating treatment to avoid sedimentation. The dense and flexible PI/BN composite films, after a drying treatment at 200°C, showed high thermal conductivity of 2.3 W/m·K−1 at a BN volume ratio of 0.6, as compared with 0.13 W/m·K−1 for pristine polyimide. However, in the case of PI/(BN + AlN) composite films, thermal conductive performance degraded because the films became highly porous at the higher AlN content. POLYM. COMPOS., 2013. © 2013 Society of Plastics Engineers

Investigation of thermal conductivity and dielectric properties of LDPE-matrix composites filled with hybrid filler of hollow glass microspheres and nitride particles

“…Modifying the surface of carbon materials with an insulating coating [12,18,20,21], the composites can be made to remain electrically insulating but they always show obviously increased D k values as compared with polymer matrix [17]. Using thermally conductive but electrically insulative ceramic particle as filler and/or by increasing its volume fraction, the electrically insulating composites with high thermal conductivities can be obtained [1,2,10,11,13,15]. However, such fillers have higher intrinsic D k values than that of polymer matrix, resulting in higher D k values at higher volume fractions of fillers [2,10,11,15].…”

“…All kinds of polymers, like polystyrene (PS) [7,9], polyethylene (PE) [10,11], polyimide (PI) [12][13][14], and epoxy [1,3,4,15] have been used as a matrix. Meanwhile, various kinds of thermally conductive materials such as oxide (Al 2 O 3 and ZnO) [3,16], carbide (SiC) [1,11], nitride (AlN, BN and Si 3 N 4 ) [1,2,[7][8][9][10], and carbon materials (graphite, carbon nanotubes and graphene) [4,[17][18][19] have been filled into polymers to improve the thermal conductivity of the resulting composites.…”

Enhanced thermal conductivity in immiscible polyimide blend composites with needle-shaped ZnO particles

“…Different types of thermally conductive llers have been incorporated into polymer matrices in order to fabricate composites with high TCs. [1][2][3][4][5][6] The most effective method to produce highly thermally conductive composites is forming a continuous network of the ller throughout the polymeric matrix (percolation). The concentration must be higher than a certain critical concentration of the ller, which is called the percolation threshold.…”

Thermal conductivity of polyimide/boron nitride nanocomposite films

“…For PI/(AlN + BN) submicron bicomposites, Kuo et al . obtained a conductivity of 2.3 W/mK for 60 vol % content . Finally, for random PI/ h ‐BN (1 μm) composites, Li et al .…”