Investigation of thermal conductivity and dielectric properties of LDPE-matrix composites filled with hybrid filler of hollow glass microspheres and nitride particles

Zhu, Bo; Wang, J.; Zheng, Heng; Ma, Jing; Wu, Jun; Wu, Ruizhi

doi:10.1016/j.compositesb.2014.10.035

Cited by 90 publications

(37 citation statements)

References 48 publications

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“…The thermal conductivity of the composites are seen to be enhanced by the surface treatment and this enhancement is seen to be more pronounced at high filler contents than at low filler contents (e.g., a fractional increase of 28.3% at 60 vol% compared to 10.7% at 30 vol% with 13.6 μm AlN powder). As mentioned previously, this enhancement of thermal conductivity was explained by enhancing bonding between the filler particles and the matrix molecules through bridging by APTES , thus reducing the voids and thus the thermal barrier at the filler‐matrix interface . As also shown in this figure, the fractional increase of thermal conductivity due to APTES surface treatment ranges from 5.7% to 28.6%.…”

Section: Resultssupporting

confidence: 66%

Thermal conductivity of epoxy resin composites filled with combustion‐synthesized AlN powder

Chung

Lin

2017

Polymer Composites

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The thermal conductivity of epoxy resin composites filled with combustion‐synthesized aluminum nitride (AlN) particles was investigated. The mixing of the composite constituents was carried out by either a dry method (involving no use of solvent) for low filler contents or a solvent method (using acetone as solvent) for higher filler contents. It was found that surface treatment of the AlN particles using a silane, 3‐aminopropyltriethoxysilane (APTES), increases the thermal conductivity of the resultant composites by a less amount compared to most of the values reported in other studies. This was explained by that the combustion‐synthesized AlN particles contain less OH or active sites on the surface, thus adsorbing less amounts of APTES. However, the thermal conductivity of the composites filled with the combustion‐synthesized AlN was found to be within the range of the values reported in other studies where commercially available AlN was used. Effects of several factors on the thermal conductivity of the epoxy resin composites were investigated including filler content (10‐60 vol%), particle size (2.5‐22.4 μm), oxygen content (0.22‐2.20 wt%) and with or without surface treatment. Within the ranges of the factors investigated in this study, it was found that the filler content has the greatest effect on the thermal conductivity of the composites. The effects of the other three factors on the thermal conductivity of the composites increase roughly with increasing filler content. Among the three factors, the effect of particle size on the thermal conductivity was found to be greater than that of the other two. POLYM. COMPOS., 39:E2125–E2133, 2018. © 2017 Society of Plastics Engineers

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Section: Resultssupporting

confidence: 66%

Thermal conductivity of epoxy resin composites filled with combustion‐synthesized AlN powder

Chung

Lin

2017

Polymer Composites

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“…Many studies have been performed with the goal to produce high thermally conductive polymeric composites by random mixing of thermally conductive and electrically insulative fillers such as hexagonal boron nitride with different polymers as the main matrix [12][13][14].…”

Section: Introductionmentioning

confidence: 99%

Effect of filler arrangement and networking of hexagonal boron nitride on the conductivity of new thermal management polymeric composites

Mosanenzadeh

Naguib

2016

Composites Part B: Engineering

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“…Unfortunately, the intrinsic low thermally conductive coefficient (λ) and insufficient thermal stability of polymeric matrix have restricted its broader application in the areas which require good heat dissipation and low thermal expansion [12][13][14][15][16][17][18][19].…”

Section: Introductionmentioning

confidence: 99%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

303

124

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With the fast-developing miniaturization and integration of microelectronics packaging materials, ultrahigh-voltage electrical devices, light-emitting diodes (LEDs), and in areas which require good heat dissipation and low thermal expansion, the investigations on the polymeric composites with highly thermal conductivities and excellent thermal stabilities are urgently required, which would be beneficial to transferring the heat to the outside of the products, finally to effectively avoid substantial overheating and prolong their working life. Our article reviews recent progress in the classification, measurement methods, model and equations, mechanisms, commonly used thermally conductive fillers, and the correlative fabrication methods for the thermally conductive polymeric composites, aiming to understand and grasp how to enhance the λ value effectively. And future perspectives, focusing scientific problems and technical difficulties of the present thermally conductive polymeric composites are also described and evaluated.

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Investigation of thermal conductivity and dielectric properties of LDPE-matrix composites filled with hybrid filler of hollow glass microspheres and nitride particles

Cited by 90 publications

References 48 publications

Thermal conductivity of epoxy resin composites filled with combustion‐synthesized AlN powder

Thermal conductivity of epoxy resin composites filled with combustion‐synthesized AlN powder

Effect of filler arrangement and networking of hexagonal boron nitride on the conductivity of new thermal management polymeric composites

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

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