Effect of filler arrangement and networking of hexagonal boron nitride on the conductivity of new thermal management polymeric composites

Mosanenzadeh, Shahriar Ghaffari; Naguib, Hani E.

doi:10.1016/j.compositesb.2015.09.021

Cited by 72 publications

(34 citation statements)

References 22 publications

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“…Isolated particles in the matrix have low or no effect in thermal transfer characteristics of composites. In such cases, the conductive network can be formed by the incorporation of nano particles; these nano particles act as a bridging or gap filling agents . In order to form the conductive network and achieve high “K” of composites, Y.K.…”

Section: Role and Effect Of Filler/hybrid Filler Addition On Thermal mentioning

confidence: 99%

“…In order to improve thermal properties of filler reinforced composites, making link between reinforced fillers and arranging/aligning the dispersed fillers in maximum possible heat flow direction are the primary requirements. S. G. Mosanenzadeh et al concluded that proper and effective network design shows better result than randomly dispersed filler composites. From Table , value of “K” not only depends on the shape, size, quantity, property of surface, and fillers dispersion but also depends on the interface distances and filler‐matrix mutual interaction.…”

Section: Role and Effect Of Filler/hybrid Filler Addition On Thermal mentioning

confidence: 99%

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Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Balasubramanian

Ramesh²

2018

Polymers for Advanced Techs

153

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Ever since the discovery of polymer composites, its potential has been anticipated for numerous applications in various fields such as microelectronics, automobiles, and industrial applications. In this paper, we review filler reinforced polymer composites for its enormous potential in microelectronic applications. The interface and compatibility between matrix and filler have a significant role in property alteration of a polymer nanocomposites. Ceramic reinforced polymeric nanocomposites are promising candidate dielectric materials for several micro‐ and nano‐electronic devices. Because of its synergistic effect like high thermal conductivity, low thermal expansion, and dielectric constant of ceramic fillers with the polymer matrix, the resultant nanocomposites have high dielectric breakdown strength. The thermal and dielectric properties are discussed in the view of filler alignment techniques and its effect on the composites. Furthermore, the effect of various surface modified filler materials in polymer matrix, concepts of network forming using filler, and benefits of filler alignment are also discussed in this work. As a whole, this review article addresses the overall view to novice researchers on various properties such as thermal and dielectric properties of polymer matrix composites and direction for future research to be carried out.

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Section: Role and Effect Of Filler/hybrid Filler Addition On Thermal mentioning

confidence: 99%

Section: Role and Effect Of Filler/hybrid Filler Addition On Thermal mentioning

confidence: 99%

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Balasubramanian

Ramesh²

2018

Polymers for Advanced Techs

153

View full text Add to dashboard Cite

show abstract

“…The mold is heated up above the melting point of the polymer matrix and closed under increased pressure for a few minutes to several hours. The mold can be filled with granules of a pre‐mixed composite , solution‐cast films or even “sandwich” structures of alternately polymer layers and fibers or other materials . Fibers can be aligned in a controlled manner to improve the materials properties in the desired directions.…”

Section: Relevance Of Processing Parametersmentioning

confidence: 99%

The relevance of material and processing parameters on the thermal conductivity of thermoplastic composites

Wieme

Tang

Delva

et al. 2017

Polymer Engineering & Sci

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Thermoplastics composites show vast promise as an alternative for thermal management applications in the scope of the development of next-generation electronics and heat exchangers. Their low cost, reduced weight, and corrosion resistance make them an attractive replacer for traditionally used metals, in case their thermal conductivity (TC) can be sufficiently increased by designing the material (e.g., filler type and shape) and processing (e.g., dispersion quality, mixing, and shaping) parameters. In the present contribution, the relevance of both types of parameters is discussed, and guidelines are formulated for future research to increase the TC of thermoplastic polymer composites. POLYM. ENG. SCI., 58:466-474, 2018.

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“…To further determine the magnetic alignment of Fe 3 O 4 @MG in silicone rubber matrix, XRD analysis was carried out. 4 This vertical alignment increases the contact area and the interface interaction between MG-MG, which in turn reduces phonon scattering and improved thermal pathways along the direction of magnetic field. This is because the vertical alignment of Fe 3 O 4 @MG makes the regular planes satisfying the Bragg's equation absent, which leads to the weakening or even disappearance of MG's diffraction peaks.…”

Section: Thermal Conductivity Of Fe 3 O 4 @Mg/silicone Rubber Composimentioning

confidence: 99%

Magnetically aligning multilayer graphene to enhance thermal conductivity of silicone rubber composites

Shi

et al. 2019

J of Applied Polymer Sci

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The increasing demand for packaging materials calls for new technologies to achieve excellent thermal conductivity of polymer composites with low content of thermal conductive filler. This article prepared a kind of magnetically functionalized multilayer graphene (Fe 3 O 4 @MG) via electrostatic interactions, which efficiently enhanced the thermal conductivity of silicone rubber (SR) composites by the alignment of Fe 3 O 4 @MG in an external magnetic field. The morphology and structure of the Fe 3 O 4 @MG together with the thermal conductivity of corresponding Fe 3 O 4 @MG/SR composites were systematically investigated by SEM, TEM, XRD, elemental mapping, and thermal conductivity tester. The obtained results showed that Fe 3 O 4 @MG was induced to form chain-like bundles in silicone rubber matrix under the applied magnetic field, which enhanced the MG-MG interaction, and formed effective thermal pathways in the alignment direction. Furthermore, as coating mass ratio of Fe 3 O 4 @MG increased, the thermal conductivity of randomly oriented Fe 3 O 4 @MG/silicone rubber composites (R-Fe 3 O 4 @MG/SR) decreased gradually, whereas the through-plane thermal conductivity of vertically aligned Fe 3 O 4 @MG/silicone rubber composites (V-Fe 3 O 4 @MG/SR) increased even filled with same contents of thermal conductive filler.

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Effect of filler arrangement and networking of hexagonal boron nitride on the conductivity of new thermal management polymeric composites

Cited by 72 publications

References 22 publications

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

The relevance of material and processing parameters on the thermal conductivity of thermoplastic composites

Magnetically aligning multilayer graphene to enhance thermal conductivity of silicone rubber composites

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