Thermal conductive properties of Ni–P electroless plated SiCp/Al composite electronic packaging material

Zhao, Haoxiang; Wei, Tang; Li, C.M.; Chen, G.C.; Lü, Fang; Cai, Yanzhi; Guo, Han; Zhang, R.Q.; Zhang, P.W.

doi:10.1016/j.surfcoat.2007.09.019

Cited by 26 publications

(2 citation statements)

References 14 publications

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“…In the microelectronic systems, great effort has been contributed to improving the integration density, fast performance, miniaturization, and low cost of electronics in recent year [1][2][3] . High thermal conductivity has become crucial to the performance [4][5][6] .…”

Section: Introductionmentioning

confidence: 99%

Rheological Behavior of Diamond Particle/Epoxy Resin Adhesive Adapted to Screen Printing

Long

2012

AMR

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The thermal conductivity & insulating adhesive was prepared by mixed with diamond particles, epoxy resin (E-20), methanol etherified amino resin, ethylene glycol monobutyl ether (BCS), mixed diethyl ester (DBE), and other additives. The influence on rheological behavior of different particle sizes, volume content of diamond particles was studied. Meantime, the effect of different concentration of dispersant and flatting agent was also investigated. The mechanism of the rheological behavior was analyzed.

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Section: Introductionmentioning

confidence: 99%

Rheological Behavior of Diamond Particle/Epoxy Resin Adhesive Adapted to Screen Printing

Long

2012

AMR

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“…SiC particles are of great technological importance for their applications as semiconductor materials and structural ceramics and have high strength with excellent corrosion, erosion resistance, thermal conductivity, and mechanical and physical properties [16][17][18][19]. A new application of SiC is found in the electronic industry for its excellent and adjustable dielectric properties [20]. With the electroless plating process, solid SiC particles used for reinforcements are added to the plating solution and are stirred to avoid sedimentation of particles in the solution, so that the co-deposition of discrete SiC particles can be obtained [19].…”

Section: Introductionmentioning

confidence: 99%

Electroless copper-phosphorus coatings with the addition of silicon carbide (SiC) particles

Faraji

Rahim

Mohamed

et al. 2011

Int J Miner Metall Mater

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Cu-P-silicon carbide (SiC) composite coatings were deposited by means of electroless plating. The effects of pH values, temperature, and different concentrations of sodium hypophosphite (NaH 2 PO 2 ·H 2 O), nickel sulfate (NiSO 4 ·6H 2 O), sodium citrate (C 6 H 5 Na 3 O 7 ·2H 2 O) and SiC on the deposition rate and coating compositions were evaluated, and the bath formulation for Cu-P-SiC composite coatings was optimised. The coating compositions were determined using energy-dispersive X-ray analysis (EDX). The corresponding optimal operating parameters for depositing Cu-P-SiC are as follows: pH 9; temperature, 90ºC; NaH 2 PO 2 ·H 2 O concentration, 125 g/L; NiSO 4 ·6H 2 O concentration, 3.125 g/L; SiC concentration, 5 g/L; and C 6 H 5 Na 3 O 7 ·2H 2 O concentration, 50 g/L. The surface morphology of the coatings analysed by scanning electron microscopy (SEM) shows that Cu particles are uniformly distributed. The hardness and wear resistance of Cu-P composite coatings are improved with the addition of SiC particles and increase with the increase of SiC content.

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Recent Advances and Emerging Trends in Electrical and Electronic Materials

Gupta¹,

Gupta²

2015

Advanced Electrical and Electronics Materials

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Thermal conductive properties of Ni–P electroless plated SiCp/Al composite electronic packaging material

Cited by 26 publications

References 14 publications

Rheological Behavior of Diamond Particle/Epoxy Resin Adhesive Adapted to Screen Printing

Rheological Behavior of Diamond Particle/Epoxy Resin Adhesive Adapted to Screen Printing

Electroless copper-phosphorus coatings with the addition of silicon carbide (SiC) particles

Recent Advances and Emerging Trends in Electrical and Electronic Materials

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