Thermal conductivity and thermo-physical properties of nanodiamond-attached exfoliated hexagonal boron nitride/epoxy nanocomposites for microelectronics

Zhang, Yinhang; Choi, Jang Rak; Park, Soo‐Jin

doi:10.1016/j.compositesa.2017.06.019

Cited by 181 publications

(73 citation statements)

References 47 publications

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“…This new peak is assigned to (010) B(OH) 3 diffraction, testifying formation of hydroxyl groups . However, it is interesting to detect the intensity of characteristic diffraction peaks of BNNSs, BNNSs‐OH, and fBNNSs are much weaker than that of BN, this phenomenon can be imputed to the multifarious lattice defects generated during the process of fabricating BNNSs …”

Section: Resultsmentioning

confidence: 99%

“…[35] However, it is interesting to detect the intensity of characteristic diffraction peaks of BNNSs, BNNSs-OH, and fBNNSs are much weaker than that of BN, this phenomenon can be imputed to the multifarious lattice defects generated during the process of fabricating BNNSs. [36,37] The interfacial thermal resistance (Kapitza resistance) formed by mismatch in the vibrational harmonics of phonons and poor interfacial compatibility between fillers and polymer can decrease phonons' mean free path and lead to heat-carrying phonons scattering during propagation, further resulting in decreasing the efficiency of fillers on enhancing www.advancedsciencenews.com www.mme-journal.de thermal conduction of polymer. [38] Therefore, the modification of polymer-filler interfaces is essential and beneficial to alleviate interface thermal resistance and enhance interfacial compatibility.…”

Section: Characterization Of Fillers and Nanocompositesmentioning

confidence: 99%

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Novel Poly(m‐phenyleneisophthalamide) Dielectric Composites with Enhanced Thermal Conductivity and Breakdown Strength Utilizing Functionalized Boron Nitride Nanosheets

Duan

Wang

et al. 2019

Macro Materials & Eng

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Dielectric polymer‐based composites with high breakdown strengths and thermal conductivities have attracted considerable attention when applied in electronic devices. In this study, a novel poly(m‐phenyleneisophthalamide) (PMIA) dielectric nanocomposite is successfully fabricated by introducing functionalized hexagonal boron nitride nanosheet (fBNNS) fillers. Due to effective functionalization of hexagonal boron nitride nanosheets (BNNSs), fBNNSs fillers are homogeneously dispersed in the PMIA matrix. The breakdown strength and thermal conductivity of PMIA/fBNNSs dielectric nanocomposite are investigated. Research results indicate that the breakdown strength of fBNNSs‐12 reaches 105.6 MV m−1, which is 1.34 times that of pure PMIA. Moreover, owing to high thermal conductivity of fBNNSs, the thermal conductivities of fBNNSs‐12 are observably increased to 8.06 W m−1 K of in‐plane direction and 0.84 W m−1 K of through‐plane direction, respectively. Considering these properties, the manufactured PMIA/fBNNSs dielectric nanocomposites show potential applications in field of electronics.

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Section: Resultsmentioning

confidence: 99%

Section: Characterization Of Fillers and Nanocompositesmentioning

confidence: 99%

Novel Poly(m‐phenyleneisophthalamide) Dielectric Composites with Enhanced Thermal Conductivity and Breakdown Strength Utilizing Functionalized Boron Nitride Nanosheets

Duan

Wang

et al. 2019

Macro Materials & Eng

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“…However, the poor combination between fillers and EP matrix limits the further performance improvement, especially in mechanical properties . In recent years, two‐dimensional (2D) materials, such as graphene oxide (GO), reduced graphene oxide (rGO), boron nitride (BN), and MoS 2 , have entered our field of vision . There are more and more research studies on the mechanical and thermal properties of EP/2D materials composites .…”

Section: Introductionmentioning

confidence: 99%

Mechanical and thermal performances of epoxy resin/graphitic carbon nitride composites

Zhu

Jiao

2019

J of Applied Polymer Sci

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In this paper, a series of graphitic carbon nitride (g-C 3 N 4 ) was synthesized under different thermal oxidation etching temperatures and epoxy/g-C 3 N 4 composites were prepared via solution blending. The morphology and structure of g-C 3 N 4 were investigated by transmission electron microscope, X-ray diffraction (XRD), Fourier transform infrared spectroscopy, and X-ray photoelectron spectroscopy. The tensile fracture morphology and structure of epoxy resin (EP) composites were demonstrated by scanning electron microscopy and XRD, respectively. Mechanical properties of EP composites were characterized by tensile testing, and the thermal performances were investigated by dynamic mechanical thermal analysis and thermal gravimetric analysis. The results revealed that the active groups on g-C 3 N 4 sheets increased under thermal oxidation etching and the C to N ratio of g-C 3 N 4 decreased from 0.94 to 0.76 with the increasing etching temperature. Noticeably, the tensile strength of EP composites was enhanced by 58% with the addition of C 3 N 4 -NS-500 and the thermal properties were also improved significantly, including T 0.5 (the decomposition temperature at the mass loss of 50%) increased by 21.5 C and glass transition temperature improved by 8 C. © 2020 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020, 137, 48598.

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“…Recently, 2D‐layered materials involved in grapheme, MoS 2, boron nitride (BN), and WS 2 have drawn much attention into the field of epoxy resin reinforcement because of their excellent mechanical properties and unparalleled structure. BN is a prospective nanofiller used for multifarious applications because of its excellent antioxidation and thermal constancy, high thermal conductivity, and outstanding mechanical properties .…”

Section: Introductionmentioning

confidence: 99%

“…9 The fracture properties of EP can be raised by applying only a few amount of inorganic nanoparticles (less than 2 wt%), and the mechanical and physical properties of the cured EP are not be damaged because of the addition of such nanoparticles. 10 Recently, 2D-layered materials involved in grapheme, 11 MoS 2,12 boron nitride (BN), [13][14][15] and WS 2 16 have drawn much attention into the field of epoxy resin reinforcement because of their excellent mechanical properties and unparalleled structure. BN is a prospective nanofiller used for multifarious applications because of its excellent antioxidation and thermal constancy, high thermal conductivity, and outstanding mechanical properties.…”

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confidence: 99%

Surface modification of boron nitride by bio‐inspired polydopamine and different chain length polyethylenimine co‐depositing

Wang

Guo

Zhu

et al. 2019

Polymers for Advanced Techs

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We established a novel, easy, and versatile method of obtaining diverse and controllable interphases between epoxy resin and fillers. The method involved the co‐deposition of polydopamine (PDA) and polyethyleneimine (PEI) with different molecular lengths on boron nitride (BN) surface. The obtained PDA/PEI‐modified BN composites showed significantly improved mechanical properties, including tensile strength, toughness, and elongation at break. For example, the tensile strength, fracture toughness, and elongation at break of EP composite increased by 51%, 132%, and 170% compared with EP when the PEI molecular weight was 10 000, respectively. These results suggested that the interphases between BN and EP matrix can be adjusted by changing the molecular lengths of grafted modifiers, thereby offering a new method for the reasonable designing and exploitation of the BN‐based composite materials.

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Thermal conductivity and thermo-physical properties of nanodiamond-attached exfoliated hexagonal boron nitride/epoxy nanocomposites for microelectronics

Cited by 181 publications

References 47 publications

Novel Poly(m‐phenyleneisophthalamide) Dielectric Composites with Enhanced Thermal Conductivity and Breakdown Strength Utilizing Functionalized Boron Nitride Nanosheets

Novel Poly(m‐phenyleneisophthalamide) Dielectric Composites with Enhanced Thermal Conductivity and Breakdown Strength Utilizing Functionalized Boron Nitride Nanosheets

Mechanical and thermal performances of epoxy resin/graphitic carbon nitride composites

Surface modification of boron nitride by bio‐inspired polydopamine and different chain length polyethylenimine co‐depositing

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