Thermal conductivity enhancement of copper–diamond composites by sintering with chromium additive

Abstract

The thermal diffusivity (TD) and thermal conductivity (TC) of Cu-Cr-diamond composite materials were examined in the temperature range from 50 to 300°C for diamond volume fractions of 22, 40, 50, 55, and 60 %. The samples were fabricated by the plasma pulse sintering (PPS) method. TC does not increase proportionally with the diamond fraction in the particular composite materials. The highest TD was determined for 50 % diamond volume fraction, and the evaluated TC reached 658 W m -1 K -1 at 50°C. This article complements earlier articles concerning synthesis and characterization of the diamond-copper composites produced by the PPS method.

High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites

“…As shown in Fig. 3b, this value is extraordinarily high among the thermal conductivities reported for Cu/diamond composites so far [6,[13][14][15][16][17][18]20,25,28,29,31,32,[36][37][38][39][40][41]. The high thermal conductivity can be explained as follows.…”

“…Metal matrix alloying [10,[12][13][14][15][16][17][18] or diamond surface coating [6,[19][20][21][22][23][24][25] with a carbide-forming element is generally utilized to solve the problem through the formation of an interlayer between Cu and diamond. In literature, the carbide-forming elements of Ti [11,25], W [6,19], Mo [26,27], Cr [7,28], Si [21,28] and B [20] have been reported to enhance the thermal conductivity of Cu/diamond composites.…”

Effect of Microstructure on the Thermal Properties of Sintered Iron-copper Composites

“…The most studied materials for thermal application are usually composed by an aluminium or copper matrix -due to their high thermal conductivity -or iron -due to the large usage of iron and its alloys as raw material for mechanical system parts [1][2][3][4][5] . Silicon carbide and diamond are widely used as additives, having high thermal conductivity and low thermal expansion that improve the dimensional stability of these composites [6][7][8][9][10] . Parts that overheat during its operation in mechanical systems intensify the energy losses in these systems.…”

Metal-ceramic functionally graded materials – manufacturing, characterization, application

“…Good cooling conditions can be guaranteed for instance by using materials with very high thermal conductivity and designing the heat dissipation system in an accurate manner. Cu-C (carbon in a form of diamond or graphene [37,38]), Cu-SiC [39], Cu-AlN [40] and Cu-Al 2 O 3 [41] belong to materials most often suggested for this purpose. The aluminum nitride-copper material pair fulfills the required criterion.…”