2015
DOI: 10.1016/j.matdes.2014.09.083
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Thermal conductivity in yttria dispersed copper

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Cited by 19 publications
(12 citation statements)
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“…Viscose fibers treated with boric compounds have shown similar degradation behavior and shift in the degradation temperature attributed to the elimination of cellulose intermolecular hydrogen bonding, which accelerates the decrystallization of the fibers [ 23 ]. A small very broad exothermic peak around 216 °C in the treated fibers can be attributed to the weak events of recrystallization of traces of copper particles that might have ended up in the sample [ 25 ]. The last exothermic peak in the treated fibers represents an overlap of several processes occurring at that range of temperatures [ 26 ].…”
Section: Resultsmentioning
confidence: 99%
“…Viscose fibers treated with boric compounds have shown similar degradation behavior and shift in the degradation temperature attributed to the elimination of cellulose intermolecular hydrogen bonding, which accelerates the decrystallization of the fibers [ 23 ]. A small very broad exothermic peak around 216 °C in the treated fibers can be attributed to the weak events of recrystallization of traces of copper particles that might have ended up in the sample [ 25 ]. The last exothermic peak in the treated fibers represents an overlap of several processes occurring at that range of temperatures [ 26 ].…”
Section: Resultsmentioning
confidence: 99%
“…Literatures on CMCs using FSP are scanty. Some investigators reinforced copper with SiC [22], Al 2 O 3 [23], TiC [24], B 4 C [25], WC [26] and Y 2 O 3 [27]. Therefore, the present work is focused on producing Cu/TiB 2 CMCs using FSP and study the microstructure in detail using FESEM, EBSD and TEM.…”
Section: Introductionmentioning
confidence: 99%
“…By comparing the CTE values at 150°C, the CTE value of microwave sintered SnCu-Ni with TiO 2 was the highest (21.33 Á 10 À6 /K) while microwave sintered Sn-Cu-Ni sample resulted had the lowest CTE value (9.33 Á 10 À6 /K). In comparison with common metal substrates used in electronic joining, at 150°C, pure Cu has a CTE value of approximately 25.00 Á 10 À6 /K [47]. Thus, although the CTE results of microwave sintered Sn-Cu-Ni with TiO 2 samples have slightly higher values compared to conventionally sintered samples, the CTE mismatch compared to pure Cu is relatively small compared to the other samples tested.…”
Section: Thermal Propertiesmentioning
confidence: 84%