Thermal conductivity of a machinable glass-ceramic below 1 K

Zych, D. A.

doi:10.1016/0011-2275(89)90145-8

Cited by 7 publications

(3 citation statements)

References 4 publications

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“…Measurements are in gratifying agreement. Omitting the results from [12] on the grounds that they are somewhat different from the remaining measurements, we obtain a smooth curve. We have no data between about 20 K and room temperature.…”

Section: Methodsmentioning

confidence: 82%

“…We should perhaps comment that we have started with materials for which good agreement has been found between different measurements; the good agreement generally seen in materials presented here should not be taken to imply that such good behaviour is universal! [4,5,6,7,8] and Macor (machineable glass ceramic) [4,9,10,11,12]. Figure 1 shows three materials.…”

Section: Introductionmentioning

confidence: 99%

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A low temperature thermal conductivity database

Woodcraft¹,

Gray²

2009

AIP Conference Proceedings

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Abstract. Low temperature detectors necessarily require low temperature instruments. Constructing good low temperature instruments requires information on the properties of materials used in their construction, in particular the thermal conductivity. Unfortunately, this is poorly known for many materials. Collections of data in text books tend to be incomplete and in the worst cases are misleading. For most materials, what information is known is scattered through the literature. Searching out this data is time consuming, and in any case often results in conflicting information. We have started a programme to locate, consolidate and critically analyse thermal conductivity measurements from the literature, particularly for the challenging temperature range below 1 K. This has already produced useful results. We present some preliminary results here.

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Section: Methodsmentioning

confidence: 82%

Section: Introductionmentioning

confidence: 99%

A low temperature thermal conductivity database

Woodcraft¹,

Gray²

2009

AIP Conference Proceedings

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“…The Cu wire was first wound on a cylindrical core made of insulating material. MACOR was chosen for the core material because it is a ceramic that can be machined easily [23]. Grooves are machined on the MACOR core to fix the Cu wire in position so that the Cu coil does not move during the process of machining the flat surface on the Cu coil.…”

Section: Experimental Designs and Proceduresmentioning

confidence: 99%

A solid-state bonding technique of large copper wires for high power devices operating at high temperature

Lee

2015

J Mater Sci: Mater Electron

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Solid-state processes of bonding 1 mm copper (Cu) wires on Cu substrates and silicon (Si) chips, respectively, were developed. To overcome Cu oxidation issue, the bonding surface on the wire was plated a silver (Ag) layer. An annealing step followed to make the Ag layer much easier to deform and conform to the Cu or Si bonding surfaces. The bonding process was performed at 300°C with 6.89 MPa. Wire-bond cross sections were studied using optical and electron microscopy, respectively. The images obtained exhibit nearly perfect Ag-Cu bonding interface. For wire-bonds made on Cu substrate, in-plane (shear) pull test measured a breaking of force 20.7-23.7 kg, comparable to the 22.5 kg breaking force of the Cu wire itself. Breaking forces on vertical (peel) pull test are about one-half of in-plane pull test results. For wire-bonds made on Si chip, breaking forces are about 80 % of those made on Cu substrate. Fracture modes were evaluated in details. 90 % of the wire-bonds broke with three modes mixed together: near Cu-Ag plating interface, inside Ag layer, and Ag-Cu bonding interface. Thus, the bonding interface is as strong as other regions of the wirebond. This solid-state wire bonding process is expected to have valuable applications in high power and high temperature devices and modules where the wire-bonds have to stand alone without protection due to lack of high temperature molding compound and reinforcing materials.

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Cryogenic Heat Transfer a Survey of Recent Developments

Chato

1991

Applications of Cryogenic Technology

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Thermal conductivity of a machinable glass-ceramic below 1 K

Cited by 7 publications

References 4 publications

A low temperature thermal conductivity database

A low temperature thermal conductivity database

A solid-state bonding technique of large copper wires for high power devices operating at high temperature

Cryogenic Heat Transfer a Survey of Recent Developments

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