Thermal conductivity of sintered porous silicon films

Wolf, Andreas; Brendel, Rolf

doi:10.1016/j.tsf.2006.01.073

Cited by 57 publications

(54 citation statements)

References 13 publications

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“…Thermal conductivity of sintered porous silicon free standing films, 3 to 27 µm in thickness with porosity between 27 and 66% was reported by Wolf and Brendel [35]. They observed an effective thermal conductivity independent of thickness but decreasing as porosity increases.…”

Section: Current State Of Knowledgementioning

confidence: 65%

Thermal Conductivity of Cubic and Hexagonal Mesoporous Silica Thin Films

Coquil

Hutchinson

Pilon

et al. 2009

Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer

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This paper reports the cross-plane thermal conductivity of highly ordered cubic and hexagonal templated mesoporous amorphous silica thin films synthesized by evaporation-induced self-assembly process. Cubic and hexagonal films featured spherical and cylindrical pores and average porosity of 25% and 45%, respectively. The pore diameters ranged from 3 to 18 nm and film thickness from 80 to 540 nm while the average wall thickness varied from 3 to 12 nm. The thermal conductivity was measured at room temperature using the 3ω method. The experimental setup and the associated analysis were validated by comparing the thermal conductivity measurements with data reported in the literature for the silicon substrate and for high quality thermal oxide thin films with thicknesses ranging from 100 to 500 nm. The cross-plane thermal conductivity of the synthesized mesoporous silica thin films does not show strong dependence on pore size, wall thickness, or film thickness. This is due to the fact that heat is mainly carried by very localized non propagating vibrational modes. The average thermal conductivity for the cubic mesoporous silica films was 0.30 ± 0.02 W/m.K, while it was 0.20 ± 0.01 W/m.K for the hexagonal films. This corresponds to a reduction of 79% and 86% from bulk fused silica at room temperature.

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Section: Current State Of Knowledgementioning

confidence: 65%

Thermal Conductivity of Cubic and Hexagonal Mesoporous Silica Thin Films

Coquil

Hutchinson

Pilon

et al. 2009

Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer

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“…[34,35] Until now, few experimental data of thermal conductivity of annealed-PS are available in literature. Recent study performed on thick porous freestanding layer by Wolf and Brendel [10] using lock-in thermography reports the room temperature thermal conductivities for porosity from 0.27 to 0.66. Figure 1a shows the experimentally studied porous structure with a porosity of 0.37 obtained after 30 min annealing at 1000 K in hydrogen atmosphere.…”

Section: Annealed Porous Siliconmentioning

confidence: 99%

“…[8] In Figure 1a and b are depicted scanning electron microscope (SEM) visualizations of PS obtained by electrochemical etching without thermal annealing [9] and thermally annealed at 1000 K during 30 min. [10] In such materials, the characteristic dimension is comparable to the mean-free-path (MFP) of the heat carrier; therefore, the validity of the macroscopic heat conduction model is questionable because the heat transport becomes affected by the pore (or the crystallite) size, the wall-roughness and the pore arrangement. In such a case, the modeling of submicron-scale energy transport, mainly by phonons in semiconductors such as silicon, prevails for understanding the thermal properties.…”

mentioning

confidence: 99%

“…[9] (b) Typical SEM micrograph of p þ type annealed PS with porosity 37%. [10] with l bulk the phonon MFP in bulk silicon and c the average crystallite size. Previous studies showed that this model is suitable for predicting thermal conductivity of highly nano-PS (f > 0.8); however, it fails for predicting thermal conductivity of moderate and low porosity nano-PS.…”

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confidence: 99%

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Combined Analytical and Phonon‐Tracking Approaches to Model Thermal Conductivity of Etched and Annealed Nanoporous Silicon

Randrianalisoa

Baillis

2009

Adv Eng Mater

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“…Laser beam interaction with silicon has been a major focus of interest of the research community because modified silicon surfaces exhibit novel functional properties [2][3][4][5][6][7][8][9][10][11][12][13][14][15]. The Nd:YAG [16][17][18], excimer [19,20] and CO 2 lasers are typically used for these purposes. Semiconducting materials with a low thermal conductivity and a high mechanical stability are required for microelectromechanical systems (MEMS) [21,22].…”

Section: Introductionmentioning

confidence: 99%

Nanomechanical properties of silicon surfaces nanostructured by excimer laser

Kumar

Kiran

2010

Science and Technology of Advanced Materials

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Excimer laser irradiation at ambient temperature has been employed to produce nanostructured silicon surfaces. Nanoindentation was used to investigate the nanomechanical properties of the deformed surfaces as a function of laser parameters, such as the angle of incidence and number of laser pulses at a fixed laser fluence of 5 J cm −2 . A single-crystal silicon [311] surface was severely damaged by laser irradiation and became nanocrystalline with an enhanced porosity. The resulting laser-treated surface consisted of nanometer-sized particles. The pore size was controlled by adjusting the angle of incidence and the number of laser pulses, and varied from nanometers to microns. The extent of nanocrystallinity was large for the surfaces irradiated at a small angle of incidence and by a high number of pulses, as confirmed by x-ray diffraction and Raman spectroscopy. The angle of incidence had a stronger effect on the structure and nanomechanical properties than the number of laser pulses.

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Thermal conductivity of sintered porous silicon films

Cited by 57 publications

References 13 publications

Thermal Conductivity of Cubic and Hexagonal Mesoporous Silica Thin Films

Thermal Conductivity of Cubic and Hexagonal Mesoporous Silica Thin Films

Combined Analytical and Phonon‐Tracking Approaches to Model Thermal Conductivity of Etched and Annealed Nanoporous Silicon

Nanomechanical properties of silicon surfaces nanostructured by excimer laser

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