1982
DOI: 10.1002/pssa.2210740157
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Thermal Conductivity, Thermoelectric Power, and Thermal Expansion of CuInS2xSe2(1−x)

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1983
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Cited by 16 publications
(8 citation statements)
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“…16,17 ͑i͒ ZnO is a chemically benign, structurally stable, low-cost n-type semiconductor whose electronic conductivity can be easily enhanced by doping to become a high electronic conductor even at low temperatures. ͑ii͒ The thermal-expansion coefficient of ZnO reported ͑i.e., 8.627 and 7.2 ϫ 10 −6 K −1 at 300 K͒ 18,19 agrees well with that of 8 mo1 % Y-doped ZrO 2 ͑i.e., ϳ7-10 ϫ 10 −6 K −1 at 298-1000 K 20 ͒. ͑iii͒ Oxygen nonstoichiometry in ZnO is considered to be small, if not negligible.…”
supporting
confidence: 87%
“…16,17 ͑i͒ ZnO is a chemically benign, structurally stable, low-cost n-type semiconductor whose electronic conductivity can be easily enhanced by doping to become a high electronic conductor even at low temperatures. ͑ii͒ The thermal-expansion coefficient of ZnO reported ͑i.e., 8.627 and 7.2 ϫ 10 −6 K −1 at 300 K͒ 18,19 agrees well with that of 8 mo1 % Y-doped ZrO 2 ͑i.e., ϳ7-10 ϫ 10 −6 K −1 at 298-1000 K 20 ͒. ͑iii͒ Oxygen nonstoichiometry in ZnO is considered to be small, if not negligible.…”
supporting
confidence: 87%
“…How then does the large discrepancy in heat conductivity arise between these two materials? Clearly, the conventional heat transport model is inadequate to explain ) for different diamondoid compounds, [24][25][26][27][28][29][30][31] the dash line is a guide to the eye. c) The temperature dependence of lattice thermal conductivity for CuGaTe 2 , CuInTe 2 , and AgGaTe 2 .…”
Section: Introductionmentioning
confidence: 99%
“…Figure 1b shows the relationship between room temperature lattice thermal conductivities and the weight factor: T m 3/2 /( m a 1/2 V a 2/3 ) for different diamondoid materials. [ 24–31 ] Obviously, the Cu‐based compounds show a much stronger mass and volume dependence behavior than that of the Ag‐based materials, which lead to a fivefold larger β factor in the former. According to Keyes’ model, the weight factor fails to explain the large disparity in heat transport properties between these materials, and the fundamental reason should be attributed to the factor of five difference in structural parameter, β .…”
Section: Introductionmentioning
confidence: 99%
“…The value of α glass is taken as 8.01 × 10 −6 /°C. As the themal expansion coefficient for Zn 0.76 Mg 0.24 O is not available, the value of ZnO is taken (8.63 × 10 −6 /°C) for α film 11. The evaluated thermal stress was found to be tensile in nature, which varied from 19 to 38 GPa with the increase of annealing temperature from 50 to 500 °C.…”
Section: Resultsmentioning
confidence: 99%