Thermal control of electronic equipment by heat pipes

Groll, M.; Schneider, Marcus; Sartre, Valérie; Zaghdoudi, Mohamed Chaker; Lallemand, M.

doi:10.1016/s0035-3159(98)80089-5

Cited by 71 publications

(24 citation statements)

References 60 publications

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“…The heat flux, q, supplied by the electric resistance of the experimental device to the cooling system, was obtained from a simplified Fourier equation [16,17]:…”

Section: Theoretical Backgroundmentioning

confidence: 99%

Characterization of cooling systems based on heat pipe principle to control operation temperature of high-tech electronic components

Dobre

Pârvulescu

Stoica

et al. 2010

Applied Thermal Engineering

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To cite this version:Tănase Dobre, Anicuţa Stoica, Gustav Iavorschi, Oana Cristina Pârvulescu.Characterization of cooling systems based on heat pipe principle to control operation temperature of hightech electronic components. Applied Thermal Engineering, Elsevier, 2010, 30 (16) This is a PDF file of an unedited manuscript that has been accepted for publication. As a service to our customers we are providing this early version of the manuscript. The manuscript will undergo copyediting, typesetting, and review of the resulting proof before it is published in its final form. Please note that during the production process errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal pertain. AbstractThe use of cooling systems based on heat pipe principle to control operation temperature of electronic components is very efficient. They have an excellent miniaturizing capacity and this fact creates adaptability for more practical situations.Starting from the observation that these cooling systems are not precisely characterized from the thermal efficiency point of view, the present paper proposes a methodology of data acquisition for their thermal characterization. An experimental set-up and a data processing algorithm are shown to describe the cooling of a heat generating electronic device using heat pipes. A Thermalright SI-97 PC cooling system is employed as a case-study to determine the heat transfer characteristics of a fins cooler.

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“…The heat flux, q, supplied by the electric resistance of the experimental device to the cooling system, was obtained from a simplified Fourier equation [16,17]:…”

Section: Theoretical Backgroundmentioning

confidence: 99%

Characterization of cooling systems based on heat pipe principle to control operation temperature of high-tech electronic components

Dobre

Pârvulescu

Stoica

et al. 2010

Applied Thermal Engineering

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“…Reviews by (Faghri 1994), (Groll et al 1998) and (Vasiliev 2005) provided detailed information on this topic. In addition, the main theoretical and numerical studies on heat pipes with capillary grooved structures were investigated by (Khrustalev and Faghri 1995a;b), (Faghri and Khrustalev 1997), (Khrustalev and Faghri 1999), (Zhang and Faghri 2001), (Jacolot et al 2008), (Do et al 2008), (Do and Jang 2010).…”

Section: Introductionmentioning

confidence: 99%

The Effect of Thickness and Permeability of Wick Structure on L-Shape Heat Pipe Performance Using Different Working Fluids

Elnaggar¹

2013

Frontiers in Heat Pipes

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This paper presents a two-dimensional FEM simulation of working fluid behavior inside L-shape heat pipe to predict wall temperature and liquid pressure under natural and forced convection modes by using ANSYS-FLOTRAN. This work aimed to numerically study the effect of thickness and permeability of wick structure using different working fluids on L-shape heat pipe performance, where water and methanol were used as working fluids. The heat inputs for natural and forced convection modes comprised 20 W and 35 W respectively whereas the heat pipe wick thicknesses were taken as 0.5 mm and 0.75 mm. The results showed that at forced convection the use of water as working fluid with 0.5 mm sintered copper wick recorded the smallest temperature difference (9.8 °C) while methanol with 0.75 mm screen mesh wick recorded the largest temperature difference (28.27 °C).

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“…Each of these methods has its merits and draw-backs, because in the choice of appropriate cooling one must take into consideration not only the thermal parameters of the cooler, but also design and stability of the system, durability, technology, price, application, etc. Heat pipes represent promising solutions for electronic equipment cooling (Groll et al, 1998). Heat pipes are sealed systems whose transfer capacity depends mainly on the fluid and the capillary structure.…”

Section: Introductionmentioning

confidence: 99%

Theoretical and Experimental Analysis of Flows and Heat Transfer Within Flat Mini Heat Pipe Including Grooved Capillary Structures

Zaghdoudi¹,

Maalej²,

Mansouri³

2011

Two Phase Flow, Phase Change and Numerical Modeling

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Thermal control of electronic equipment by heat pipes

Cited by 71 publications

References 60 publications

Characterization of cooling systems based on heat pipe principle to control operation temperature of high-tech electronic components

Characterization of cooling systems based on heat pipe principle to control operation temperature of high-tech electronic components

The Effect of Thickness and Permeability of Wick Structure on L-Shape Heat Pipe Performance Using Different Working Fluids

Theoretical and Experimental Analysis of Flows and Heat Transfer Within Flat Mini Heat Pipe Including Grooved Capillary Structures

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