Thermal cycling analysis of high temperature die-attach materials

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

“…This increase in contact area will facilitate the diffusion process, thus promoting sintering at elevated temperatures. 79 This conclusion is repeatable, whether the sintered Ag joints are made from printed nano-Ag paste 85,86 or sputtered Ag. 19 In the case of a sputtered or deposited Ag layer, the surface roughness determines the initial contact areas between the bonding surfaces.…”

“…It remains to be seen whether these models can be used to predict the lifetimes of sintered Ag joints produced elsewhere. On the other hand, the generalized Garofalo steady-state creep model was found to be applicable only for the lifetime prediction of sintered Ag joints Influence of substrate roughness (R a ) on the die shear strength of sintered Ag joints produced using nano-Ag paste 85,86 or sputtered Ag. 19 In these two studies, the nano-Ag pastes were procured from similar sources, and their filler sizes were less than 100 nm.…”

Reliability of Ag Nanoporous Bonding Joint for High Temperature Die Attach under Temperature Cycling

“…Mei et al 9) used a nite element method and reported that the maximum thermal stress of a Ag sintered joint induced by temperature cycling was mainly generated at the corner of the joint. Navarro et al 16) also showed that the maximum normal stress was generated at the corner of the bonding interface; and it sharply decreased toward the center of the joint at 275 C. It seems reasonable that the fracture at the Ag porous bonding layer is initiated at the corner of joint. Nevertheless, the delamination of Ag layer was not signi cant up to 1500 cycles.…”

“…A non-uniform or an excessive compression stress can cause a crack in the Si because of the fragile nature of a Si wafer. Another cause of crack propagation in a Si chip is the thermal stress experienced during a temperature cycling test 16) . During the temperature swing, a large stress is generated at the joint, as a result of the CTE mismatch between the Si wafer and bonding material/substrate.…”

Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment

“…These microstructural features in the sintered Ag joints depend on both the formulation of the paste and the sintering parameters such as heating rate, sintering temperature, pressure and time, and have effects on the thermal and electrical performance and thermo-mechanical reliability of the sintered Ag joints in service. In the existing literature [20]- [21], the values of thicknesses and porosity of the sintered Ag joints were reported. However, there was no work which has been carried out to explore the variation in those reported values and their quantitative dependence on the sintering parameters.…”