2014
DOI: 10.1007/s11664-013-2967-3
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Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Abstract: Silver (Ag) has been under development for use as interconnect material for power electronics packaging since the late 1980s. Despite its long development history, high thermal and electrical conductivities, and lead-free composition, sintered Ag technology has limited market penetration. This review sets out to explore what is required to make this technology more viable. This review also covers the origin of sintered Ag, the different types and application methods of sintered Ag pastes and laminates, and the… Show more

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Cited by 278 publications
(80 citation statements)
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“…Currently, the development of a bonding method that works at temperatures below 300 1C is important for electronic packaging and interconnections [1][2][3][4][5][6][7]. In this study, we developed a process that possesses the benefits of a lower processing temperature and the adoption of more conductive materials.…”
Section: Introductionmentioning
confidence: 99%
“…Currently, the development of a bonding method that works at temperatures below 300 1C is important for electronic packaging and interconnections [1][2][3][4][5][6][7]. In this study, we developed a process that possesses the benefits of a lower processing temperature and the adoption of more conductive materials.…”
Section: Introductionmentioning
confidence: 99%
“…Good candidates for high temperature applications are eutectic alloys of Au-Sn (280°C) and Au-Ge (356°C), but it is not rational to apply Au to a large area die attach due to its extremely high cost. Although a new die-attachment structure using pure zinc solder for SiC die attachment was proposed [11], it has certain drawbacks: a high bonding temperature (more than 420°C) causing irreversible damage or accelerated aging affects to the electronic devices [12]; a poor ductility and limited oxidation resistance due to Zn [13].Many researchers have investigated bonding techniques that involve sintering of Ag nanoparticles, because Ag has high thermal and electrical conductivity, and Ag nanoparticles can be produced easily and be sintered at relatively low temperatures due to their high stability against oxidation [14][15][16][17]. However, Ag is expensive and is poorly resistant to migration.…”
mentioning
confidence: 99%
“…Additional advantages are the high electrical and thermal conductivity of the sintered silver layer, high adhesive strength of the interconnect, as well as good stability at thermal cycling load. 5,6 Another feature of PASPS is its high potential for automation in combination with a proprietary foil transfer method. 7 First, ceramics are metalized using electron beam physical vapor deposition (EBPVD).…”
Section: Fabrication and Measurementsmentioning
confidence: 99%