ABSTRACT:The melt polycondensation of the two kinds of the bis(hydroxydiphenylsilyl)arylene monomers, 1,4-bis(hydroxydiphenylsilyl)benzene and 4,4 0 -bis(hydroxydiphenylsilyl)biphenyl, was investigated. The thermal properties of the obtained polymers were studied by using a thermogravimetry analysis, a differential scanning calorimetry and a thermomechanical analysis. The IR spectra and the XRD patterns of the polymers indicated that the melt polycondensation occurred in the temperature range from 290 C to 400 C. The 5% weight loss temperatures of the polymers synthesized at above 350 C was around or over 500 C, so that these polymers exhibited high thermal stability. All the polymers which were obtained by the melt polycondensation of 1,4-bis(hydroxydiphenylsilyl)benzene exhibited the glass transition temperatures. On the contrary, the polymers obtained from 4,4 0 -bis(hydroxydiphenylsilyl)biphenyl at above 350 C showed no phase transitions in the DSC measurements. From the analysis of the volatile compounds generated during the melt polycondensation of 4,4 0 -bis(hydroxydiphenylsilyl)biphenyl by using a gas chromatograph mass spectrometry and the comparison of the 13 C CP-MAS NMR spectra of the polymers, it was shown that the cross-linking reaction resulting from the thermal decomposition of the monomers and the produced oligomers took place simultaneously. It was revealed that the melt polycondensation and simultaneous cross-linking reaction were effective to obtain the polysilarylenesiloxanes which have high thermal degradation temperature and high thermomechanical stability. have been investigated as high temperature elastomers. The common characteristics of these polymers are their high thermal degradation temperatures (T d 's) and low glass transition temperatures (T g 's), which are attributed to their flexible tetramethyldisiloxane units in the main chain. 2-18 These characteristics are desirable for an elastomer, and are, however, undesirable for the heat-resistant materials such as a high-temperature coating and a low dielectric insulation material in semiconductor devices because the thermomechanical stability of these polymers is not enough at high temperature. Therefore, polysilarylenesiloxanes and their copolymers have never been used nothing but elastomers. If a new type of polysilarylenesiloxane with a high T g is obtained, it is possible that the polysilarylenesiloxane is applied to such heat-resistant materials.On the other hand, we reported that the fully aromatic polysilarylenesiloxanes, which were synthesized via the solution polymerization, poly(tetraphenyl-p-silphenylenesiloxane) (polyPS) and poly(tetraphenyl-p,p 0 -silbiphenylenesiloxane) (polyBS), showed no weight loss in air below 500 C and had high melting temperatures (T m 's) of 323 C and 391 C, respectively 19 (Figure 1). It was revealed that these polymers were candidates for new heat-resistant materials. Unfortunately, these polymers were obtained as insoluble powder, therefore, these polymers had a drawback to a practical use. I...