Thermal, dielectric, and mechanical properties of SiC particles filled linear low‐density polyethylene composites

Abstract

A thermally conductive linear low-density polyethylene (LLDPE) composite with silicon carbide (SiC) as filler was prepared in a heat press molding. The SiC particles distributions were found to be rather uniform in matrix at both low and high filler content due to a powder mixing process employed. Differential scanning calorimeter results indicated that the SiC filler decreases the degree of crystallinity of LLDPE, and has no obvious influence on the melting temperature of LLDPE. Experimental results demonstrated that the LLDPE composites displays a high thermal conductivity of 1.48 Wm À1 K À1 and improved thermal stability at 55 wt % SiC content as compared to pure LLDPE. The surface treatment of SiC particles has a beneficial effect on improving the thermal conductivity. The dielectric constant and loss increased with SiC content, however, they still remained at relatively low levels (<10 2 Hz); whereas, the composites showed poorer mechanical properties as compared to pure LLDPE. In addition, combined use of small amount of alumina short fiber and SiC gave rise to improved overall properties of LLDPE composites.

Preparation and properties of epoxy/BN highly thermal conductive composites reinforced with SiC whisker

“…Therefore, obvious increase of dielectric constant is shown with further introduction of 3% KH560-SiCw. Though the dielectric constant of epoxy/KH550-BN composite improves with the addition of 3% KH560-SiCw, the results prove the composite still possesses rather good insulating properties for the application in dielectric fields [46], which could not be maintained with the use of carbon fiber as reinforced fillers by previous researcher [28].…”

A Carboxyl-Terminated Polybutadiene Liquid Rubber Modified Epoxy Resin with Enhanced Toughness and Excellent Electrical Properties

“…13 The excellent electrical insulation properties are important to the modified EP when used as electronic substrates and plastic packaging materials because they can effectively extend the lifespan of electronic devices operating under high electric fields. 29 The dielectric strength's ability to withstand a high electric field for a dielectric application should be considered. Figure 9 presents the dielectric strength's dependence on the CTPB content.…”

Preparation and characteristics of nano-B4C/PVA particles and ultra high molecular weight polyethylene composites

“…This means that addition of B 4 C in UHMWPE decreases the crystallinity of the composites compared to pure UHMWPE. It is assumed that the filler particles decrease the mobility of the UHMWPE chains for producing crystalline structure [32,33]. As a result, the degree of crystallinity decreases as the filler contents increase and filler size decreases.…”