Thermal Effect Modeling on Passive Circuits With MLP Neural Network for Emc Application

Abstract

During the last two decades, several simulation tools have been proposed for the modeling of electronic equipments in function of the physical environmental changes. It was stated that numerous electronic components such as semiconductor devices can be affected by the mechanistic effects, humidity or simply the temperature variations. To study the last effect, based on the multilayer perceptron neural network (MLPNN), a characterization method of the passive electronic device thermal effects is introduced in this paper. The method proposed was realized toward the equivalent circuit identification of the under test device (R, L, C components) measured input impedances. To demonstrate the relevance of the method, numerical computations with MLPNN algorithms implemented into Matlab were performed. First, a capacitor modeling from 30 kHz to 1 GHz for the temperature variation from 25 • C to 130 • C is presented. It was found that a good agreement between the proposed model and the measurement is observed. Then, a commercial EMI low-pass filter was also characterized in RF frequencies through the S-parameter identification. Finally, further discussion on the potential applications of this work, in particular, in the electromagnetic compatibility (EMC) field is offered in the last part of this paper.

EMI Filter Design for a Single-stage Bidirectional and Isolated AC–DC Matrix Converter

“…This can be explained by the parasitic series inductance of capacitors and the capacitance across the choke coils [56]. There are modeling methods for passive components that can be used to predict the high frequency parasitic effects that typically create EMC degradation [57]. For the current project, the required attenuation at these high-frequencies is less than the attenuation required at 160 kHz.…”

Multiphysics Modeling and Optimization of a Compact Actuation System

“…Beyond this limit of 10MHz, the EMC filter can be unobtrusively sized without particular precautionary measure concerning the volume of the components. Passive components are characterized using a Vector Network Analyzer (VNA) [8], and their impedances, deduced from these measurements, are matched to equivalent models, as illustrated in Fig. 9.…”

Reliability of Boost PFC Converters with Improved EMI Filters

“…Modeling of metallic wire susceptibility to the disturbances caused by electromagnetic near-field radiation by electronic structures in radio frequencies was introduced to suppress radiated EMC coupling of a power converter in Reference [13]. Furthermore, scholars also studied the influence of temperature and bandwidth on a power converter's lumped components [14]. These studies are helpful for the suppression of EMC in power converters.…”