Thermal expansion behaviour of high performance PEEK matrix composites

Abstract

The thermal expansion behaviour of high performance poly(ether-ether-ketone) (PEEK) composites reinforced with micro- (8 µm) and nano- (39 nm) sized Al2O3 particles was studied. The distribution of Al2O3 in the PEEK matrix was studied by scanning electron microscopy and transmission electron microscopy. The coefficient of thermal expansion (CTE) was reduced from 58 × 10−6 °C−1 for pure PEEK to 22 × 10−6 °C−1 at 43 vol% micro-Al2O3 and to 23 × 10−6 °C−1 at 12 vol% nano-Al2O3 composites. For a given volume fraction, nano-Al2O3 particles are more effective in reducing the CTE of composites than that of micro-Al2O3 particles. This may be attributed to the much higher interfacial area or volume of nanocomposites than that of microcomposites. The upper limit and lower limit of the Schapery model separately fit closely the CTE of the micro- and nano-composites, respectively. Other models such as the rule of mixture and Kerner and Turner models were also correlated with the data.

Novel high performance Al2O3/poly(ether ether ketone) nanocomposites for electronics applications

“…This discrepancy may be accounted for the large surface area to volume ratio of n-Al 2 O 3 filler, which constraint more PEEK matrix fraction, as compared to conventionally used micron size fillers as models are developed for latter. The CTE of the PEEK composite reinforced with 12 vol% micro-Al 2 O 3 (size: 8 lm) was decreased to 37 · 10 À6 /°C [39], which is much higher than that of PEEK reinforced with 12 vol% nano-Al 2 O 3 . For example, for a constant filler loading in a same volume of composite, nanofiller of size 40 nm will have one million times number of nano particles than that of conventionally used filler of 4 lm [40].…”

Effect of homogeneous Al(OH)3 covered MWCNT addition on the thermal conductivity of Al2O3/epoxy-terminated poly(dimethylsiloxane) composites

“…To calculate the D ip between adjacent conducting particles, it was assumed that the particles were homogeneously distributed within the matrix and were perfectly bound to the polymer. From previous work [31], the interparticle distance in the polymer/particle system can be determined by…”

Preparation and Properties of New Polyphenylene Sulfide/AlN Composites for Electronic Packaging

“…This is due to the constraints imposed by the microsized, irregularly shaped AlN particles on the mobility of the polymer chains. 31,32 The glass-transition temperature (T g ) was considered as the meeting point of tangents extrapolated from curves of thermal strain versus temperature. T g increases with increasing AlN content, i.e., from 84°C for pure PPS to 97°C for the 15.1 vol.% composite, as shown in Fig.…”