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Thermal Fatigue Life of Through-hole Soldered Joints on Printed Circuit Boards.
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“…It is generally known that degradation of solder joint is caused by repeated thermal stress of components surrounding solder bjoint. [5] The difference of thermal expansion coefficient between solder joint and components induces thermal stress. The solder joint failure is observed in visual as micro cracks initially.…”
Section: Pbsn Soldermentioning
confidence: 99%
“…It is generally known that degradation of solder joint is caused by repeated thermal stress of components surrounding solder bjoint. [5] The difference of thermal expansion coefficient between solder joint and components induces thermal stress. The solder joint failure is observed in visual as micro cracks initially.…”
Section: Pbsn Soldermentioning
confidence: 99%
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