Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices

Sakamoto, S.; Nagao, Shijo; Suganuma, Katsuaki

doi:10.1007/s10854-013-1138-x

Cited by 56 publications

(22 citation statements)

References 30 publications

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“…66 The formation of Kirkendall voids in the interfacial regions further exacerbate this thermal-fatigue failure. 65,66 Among the various substrates on the market, bare copper has emerged as the most desirable surface for Ag joints. In one thermal-cycling study that used bare copper as a substrate, air-sintered Ag joints exhibited higher thermal and electrical resistance than Ag joints formed in a nitrogen atmosphere.…”

Section: Interfacial Characteristics Of Sintered Ag Jointsmentioning

confidence: 99%

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Siow

2014

Journal of Elec Materi

278

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Silver (Ag) has been under development for use as interconnect material for power electronics packaging since the late 1980s. Despite its long development history, high thermal and electrical conductivities, and lead-free composition, sintered Ag technology has limited market penetration. This review sets out to explore what is required to make this technology more viable. This review also covers the origin of sintered Ag, the different types and application methods of sintered Ag pastes and laminates, and the long-term reliability of sintered Ag joints. Sintered Ag pastes are classified according to whether pressure is required for sintering and further classified according to their filler sizes. This review discusses the main methods of applying Ag pastes/laminates as dieattach materials and the related processing conditions. The long-term reliability of sintered Ag joints depends on the density of the sintered joint, selection of metallization or plating schemes, types of substrates, substrate roughness, formulation of Ag pastes/laminates, joint configurations (i.e., joint thicknesses and die sizes), and testing conditions. This paper identifies four challenges that must be overcome for the proliferation of sintered Ag technology: changes in materials formulation, the successful navigation of the complex patent landscape, the availability of production and inspection equipment, and the health concerns of Ag nanoparticles. This paper is expected to be useful to materials suppliers and semiconductor companies that are considering this technology for their future packages.

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Section: Interfacial Characteristics Of Sintered Ag Jointsmentioning

confidence: 99%

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Siow

2014

Journal of Elec Materi

278

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“…As an effort to eliminate the Pb containing solders in high temperature electronics, numerous alternative Pb-free bonding techniques that could be used for high temperature die attach have been reported, including high melting temperature solders, such as Au- 4) , Bi- 5) , and Zn-based 6) solders; transient liquid phase bonding 7) , and Ag sintering methods using a nanoparticle [8][9][10] or Ag nanoporous sheet 11,12) . Among these, in our previous research, we successfully demonstrated a novel die attach method using a Ag nanoporous sheet, called Ag nanoporous bonding (NPB), without the aid of the any organic substance.…”

Section: Introductionmentioning

confidence: 99%

Reliability of Ag Nanoporous Bonding Joint for High Temperature Die Attach under Temperature Cycling

Kim

Matsunaga

et al. 2016

Mater. Trans.

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The long-term reliability of a Ag nanoporous bonding joint for high temperature die attach under temperature cycling from −55 C to 150 C was investigated. A Ag nanoporous sheet was adopted as a bonding layer for the die attach of a Si chip on an active metal brazed Cu Si 3 N 4 substrate. The initial joint strength was similar to that with Pb-5Sn die attach. There was no signi cant change in the joint strength after temperature cycling up to 1500 cycles. It was possible to con rm that the shear strength of the Ag nanoporous bonding joint had good stability under temperature cycling.

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“…Basically, AgMPs paste required higher applied pressure even 40 MPa for sintering because of less driving force than AgNPs [9]. To reduce the pressure during bonding, the morphology changes of AgMPs were tried such as the chestnut-burr-like (CBL) and flake particles [10,11]. These particles have a large surface area to volume like AgNPs, and resulting in a relatively low pressure of 0.4 -10 MPa during process.…”

Section: Introductionmentioning

confidence: 99%

Bonding process without pressure using a chestnut-burr-like particle paste for power electronics

Roh

Nishikawa

Tsutsumi

et al. 2016

2016 International Conference on Electronics Packaging (ICEP)

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High-lead-containing solder has been pushed to the limit of high-temperature stability and eco-friendly technology for next-generation power electronic devices. Silver is an attractive material as alternative of high-lead solder due to its high melting point and good electrical and thermal properties. However, silver nanoparticle paste is high cost, and contains a number of organic materials such as solvent and dispersants. These tend to produce unexpected large voids in the sintered layer after heating, and this affects the properties and reliability of devices. In this study, silver pastes composed only micro-sized particles were used for joints and a bonding without applied pressure was tried. Chestnut-burr-like silver particles was prepared for bonding without pressure and the effect of addition of small and spherical silver particles on bondability was investigated. The addition of spherical particles in chestnut-burrlike particle paste was promoted the sintering behavior. The joint using mixed silver particle with the weight ration of 5:5 showed the shear strength of 18.6 MPa, which was comparable to those of silver nanoparticle pastes by pressureless process.

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Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices

Cited by 56 publications

References 30 publications

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Reliability of Ag Nanoporous Bonding Joint for High Temperature Die Attach under Temperature Cycling

Bonding process without pressure using a chestnut-burr-like particle paste for power electronics

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