Thermal Fatigue Reliability of SMT Packages and Interconnections

Lau, John H.; Harkins, G.; Rice, D.; Král, Jan

doi:10.1109/irps.1987.362186

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Models and Procedures1

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Cited by 20 publications

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“…Similar results are presented in[8]. However, when keeping the same devices and lead frames but changing the substrate material from FR-4 to Kevlar, large increases in solder joint EPEQ values occur.…”

supporting

confidence: 80%

“…For this, the lead frame CTE was varied at each of the four lead frame moduli. From previous SOT-23 experience [2], as well as other finite element work [8], a minimum CTE of 5 ppm/"C, approximately that of Kovar, was chosen. The maximum value was chosen to exactly match that of 60/40 solder, 24 ppm/"C. Additionally, intermediate CTE's of 10 ppm/"C and 20 ppm/"C were executed to confirm the output pattems.…”

Section: Models and Proceduresmentioning

confidence: 99%

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