Thermal management of an IGBT module using two-phase cooling

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

“…As shown in Fig. 5 [19], the device temperature rise values in a conventional package reported by Malu et al [19] were between 36 C and 39 C for an HTC range of 10-20 kW m À2 K À1 . Extrapolating the curves for the conventional package using a hyperbolic function consistent with Newton's law of cooling, an AlSiC heat sink could be competitive with the conventional power electronics package in terms of device temperatures, if a 3 mm plate were used with an HTC of 50 kW m À2 K À1 and above.…”

“…In contrast, the change in device temperature with any change in HTC was found to be minimal for a 9 mm thick AlSiC plate. The 9 mm thick baseplate and heat sink assembly (Cu baseplate and Al heat sink) beneath the solder attach studied by Malu et al [19] exhibit a similar behavior when HTC values are changed. This means that, for a conventional stack, any major increase in HTC may not yield appreciable decrease in DT Max .…”

“…2 and material layer sequence as shown in Fig. 1(b) [19]. The Toyota Prius design was chosen or a one-on-one comparison of device temperatures and heat spreading with the new package.…”

“…While not all IGBTs and diodes may be dissipating heat at the same time, they are assumed to do so in the present work, as this is comparative exercise. Table 2 shows the summary of the operating conditions and thicknesses of the individual layers used in the steady-state thermal simulations, which are adapted from the work by Malu et al [19]. The footprint of the devices and the rest of the material layers remained the same as the original geometry, the details of which are described in the work by Malu et al [19].…”

“…3, a range of convection HTCs at 30 C was applied on the backside of the AlSiC heat sink and the maximum device temperature was noted for each of these simulations. Although 30 C was not a realistic value of the coolant inlet temperature for automotive applications, it was chosen for this set of simulations for a one-to-one comparison with the conventional module studied by Malu et al [19]. Furthermore, while detailed fluid flow modeling accounting for coolant heating is described in Sec.…”