Thermal optimization of IGBT modules based on finite element method and particle swarm optimization

Alavi, Omid; Abdollah, Mohammad; Viki, Abbas Hooshmand

doi:10.1007/s10825-017-1023-6

Cited by 9 publications

(2 citation statements)

References 28 publications

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“…Particle swarm optimization (PSO) algorithm combined with 3-D finite-difference time-domain technique has been proposed to pursue ultra-compact silicon waveguides with low bending loss (Fu et al , 2021). Similarly, PSO can be combined with the FE model to optimize the location of heat-generating chips in the power module, and the optimized design will result in lower junction temperatures and lower overall temperature of the power module (Alavi et al , 2017). The reported methods provide guidance for the electronic packaging structure adjustment.…”

Section: Introductionmentioning

confidence: 99%

Data-driven electronic packaging structure inverse design with an adaptive surrogate model

Liu

Xue

Lian

et al. 2023

SSMT

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Purpose The conventional design method relies on a priori knowledge, which limits the rapid and efficient development of electronic packaging structures. The purpose of this study is to propose a hybrid method of data-driven inverse design, which couples adaptive surrogate model technology with optimization algorithm to to enable an efficient and accurate inverse design of electronic packaging structures. Design/methodology/approach The multisurrogate accumulative local error-based ensemble forward prediction model is proposed to predict the performance properties of the packaging structure. As the forward prediction model is adaptive, it can identify respond to sensitive regions of design space and sample more design points in those regions, getting the trade-off between accuracy and computation resources. In addition, the forward prediction model uses the average ensemble method to mitigate the accuracy degradation caused by poor individual surrogate performance. The Particle Swarm Optimization algorithm is then coupled with the forward prediction model for the inverse design of the electronic packaging structure. Findings Benchmark testing demonstrated the superior approximate performance of the proposed ensemble model. Two engineering cases have shown that using the proposed method for inverse design has significant computational savings while ensuring design accuracy. In addition, the proposed method is capable of outputting multiple structure parameters according to the expected performance and can design the packaging structure based on its extreme performance. Originality/value Because of its data-driven nature, the inverse design method proposed also has potential applications in other scientific fields related to optimization and inverse design.

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Section: Introductionmentioning

confidence: 99%

Data-driven electronic packaging structure inverse design with an adaptive surrogate model

Liu

Xue

Lian

et al. 2023

SSMT

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“…Because residual stresses are so important to reliability of target assembly, the determination of residual stresses intensity and distribution are necessary. However, since residual stresses are very complex, there are few research papers on the residual stresses in target assembly, and most of the attentions have been just focused on the reliability of the electronic products [12][13][14][15][16]. Generally, the stress measurement techniques can be divided into nondestructive techniques and destructive techniques according to whether specimen is destructed or not.…”

Section: Introductionmentioning

confidence: 99%

Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method

Jiang

Zhang

Liu

2019

Acta Metall. Sin. (Engl. Lett.)

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Target assembly is a key consumable material for producing thin film used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of target assembly. In this work, the intensity and distribution of the soldering residual stress of Co/In/Cu target assembly subjected to a 20 W/(m 2 K) cooling condition corresponding to the actual air cooling process were studied, based on finite element simulation and Taguchi method, to optimize the sputtering target assembly. Effects of different control factors, including solder material, thickness of solder layer, target and backing plate, on the soldering residual stress of target assembly are investigated. The maximum residual stress is calculated as 9.28 MPa in the target located at 0.16 mm from target-solder layer interface and at a distance of 0.78 mm from symmetry axis. The optimal design in target assembly has the combination of indium solder material, cobalt target at 12 mm thick, solder layer at 0.8 mm thick, copper backing plate at 15 mm thick. Moreover, solder material is the most important factor among control factors in the target assembly.

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A split-gate trench IGBT with low Miller capacitance and dV/dt noise

He¹,

Luo²,

Qin³

et al. 2020

J Comput Electron

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Thermal optimization of IGBT modules based on finite element method and particle swarm optimization

Cited by 9 publications

References 28 publications

Data-driven electronic packaging structure inverse design with an adaptive surrogate model

Data-driven electronic packaging structure inverse design with an adaptive surrogate model

Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method

A split-gate trench IGBT with low Miller capacitance and dV/dt noise

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