Thermal management of diode laser arrays

Huddle, J.J.; Chow, L. C.; Lei, Shu-Ye; Marcos, A.; Rini, Daniel P.; Lindauer, Steven J.; Bass, Michael; Delfyett, Peter J.

doi:10.1109/stherm.2000.837078

Cited by 10 publications

(4 citation statements)

References 5 publications

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“…The rapid development of high-power electronic, energy, and propulsion devices [2][3][4] has led us to the point where the performances of these devices are limited by their heat dissipation capacities [5,6]. Today, the typical heat flux generated by an electronic chip can reach 10-10 2 W/cm 2 [7,8], and in designing next-generation power electronics, it can exceed 1000 W/cm 2 on average at the chip level [9,10] and 1500-5000 W/cm 2 at the hotspots [3,11], which, if not fully dissipated, results in a temperature rise and a large temperature gradient, causing performance deterioration or even failure of the whole system. Stable and reliable operation of high-power systems requires the cooling system to achieve precise and uniform temperature control, a timely response to a wide range of thermal loads, and reliable startup and long-term stability [3,6,12].…”

Section: Introductionmentioning

confidence: 99%

Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

Wang

Jiang

2021

Journal of Electronic Packaging

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The rapid development of electronics, energy and propulsion systems has led us to the point where their performances are limited by cooling capacities. Heat fluxes of 10~100, even over 1,000 W/cm2 need to be dissipated with minimum coolant flow rate in next-generation power electronics. Spray cooling is a high heat flux, uniform and efficient cooling technique proven effective in various applications. However, its cooling capacity and efficiency need to be further improved to meet next-generation ultrahigh-power applications. Engineering of surface properties and structures can fundamentally affect the liquid-wall interactions, thus becoming the most promising way to enhance spray cooling. However, the unclear mechanisms of surface-enhanced spray cooling cause lack of guiding principles for surface design. Here, progress in spray cooling on surfaces with structures of different scales are reviewed and their performances evaluated and compared. Spray cooling can achieve critical heat flux (CHF) above 945 W/cm2 and heat transfer coefficient (HTC) up to 57 W/cm2K on structured surfaces for pressurized nozzle and CHF and HTC up to 1250 W/cm2 and 250 W/cm2K, respectively, on a smooth surface with the assistance of secondary gas flow. CHF enhancement of 110% was achieved on hybrid micro- and nanostructured surfaces. A clear map of enhancement mechanisms is proposed after analysis. Some future concerns are also proposed. This work helps the understanding and design of engineered surfaces in spray cooling and provides insights for interdisciplinary applications of heat transfer and advanced engineering materials.

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Section: Introductionmentioning

confidence: 99%

Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

Wang

Jiang

2021

Journal of Electronic Packaging

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“…To improve the performance and reliability of laser diode arrays, thermal system designs should strive to limit temperature oscillations in the active areas. While a number of thermal management techniques such as flow boiling [64], microchannel liquid cooling [68][69][70], thermoelectric cooling [71,72], spray cooling [73,74], and jet impingement [75] have been demonstrated to dissipate the high heat fluxes generated by laser diode arrays, they are based on the steady-state cooling objective of minimizing thermal resistance. To address the transient thermal challenges of laser diode arrays, cooling systems should tune both the thermal resistance and thermal capacitance to reduce temperature fluctuations and provide a response in a timescale of milliseconds.…”

Section: High-powermentioning

confidence: 99%

A Review On Transient Thermal Management of Electronic Devices

Mathew

Krishnan

2021

Journal of Electronic Packaging

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Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varying workloads. These include microprocessors (particularly those used in portable devices), power electronic devices such as IGBTs, and high-power semiconductor laser diode arrays. Transient thermal management solutions become essential to ensure the performance and reliability of such devices. In this review, emerging transient thermal management requirements are identified, and cooling solutions reported in the literature for such applications are presented with a focus on time scales of thermal response. Transient cooling techniques employing actively controlled two-phase microchannel heat sinks, phase change materials (PCM), heat pipes/vapor chambers, combined PCM-heat pipes/vapor chambers, and flash boiling systems are examined in detail. They are compared in terms of their thermal response times to ascertain their suitability for the thermal management of pulsed workloads associated with microprocessor chips, IGBTs, and high-power laser diode arrays. Thermal design guidelines for the selection of appropriate package level thermal resistance and capacitance combinations are also recommended.

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“…Additionally, in comparison with the jet nozzle, nozzle orifice through the spray coolant is even smaller, increasing the possibility of orifice clogging and the occurrence of the dry-out area on the heated surface [6]. In spite of these barriers, spray cooling is still a popular cooling technology and many successful applications were reported for supercomputer (CRAY X-1) [7], laser diode laser arrays [8], microwave source components [9] and NASA's reduced gravity aircraft [10].…”

Section: Introductionmentioning

confidence: 99%

Spray Impingement Cooling: The State of the Art

Gao¹,

Li²

2019

Advanced Cooling Technologies and Applications

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The cooling of a surface can be achieved by the impingement of spray, which is a free surface flow of droplets ejected from a spray nozzle. Spray cooling can provide uniform cooling and handle high heat fluxes in both single phase and two phases. In this chapter, spray cooling is reviewed from two aspects: the entire spray (spray level) and droplets (droplet level). The discussion on the spray level is focused on the spray cooling performance as a function of fluid properties, flow conditions, surface conditions, and nozzle positioning. The advantages and barriers of using spray cooling for engineering applications are summarized. The discussion on the droplet level is focused on the impact of droplet flow on film flow, which is the key flow mechanism in spray cooling. Droplet flow involves single droplet, droplet train (continuously droplets broke up from jet flow), and droplet burst (droplet groups affecting at a constant frequency), and local cooling enhancement due to droplet flow is discussed in details. Future work and unresolved issues in spray cooling are proposed.

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Thermal management of diode laser arrays

Cited by 10 publications

References 5 publications

Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

A Review On Transient Thermal Management of Electronic Devices

Spray Impingement Cooling: The State of the Art

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